Room-temperature microjoining using ultrasonic bonding of compliant bump

Keiichiro Iwanabe; Takanori Shuto; Kazuhiro Noda; Seiya Nakai; Tanemasa Asano

doi:10.1109/LTB-3D.2012.6238081

Room-temperature microjoining using ultrasonic bonding of compliant bump

Keiichiro Iwanabe, Takanori Shuto, Kazuhiro Noda, Seiya Nakai, Tanemasa Asano

Integrated Electronic Systems

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

9 Citations (Scopus)

Abstract

Ultrasonic bonding was applied to cone-shaped microbump made of Au on a Si chip to perform bonding at room temperature. Array of cone-shaped microbump having 10 m in diameter and 20μm in pitch was formed on Si using photolithography and electroplating. The counter electrode was a planar electrode which was also made by using electroplating of Au. Bonding was carried out at room temperature under conventional air circumstances. It has been found that bump array whose number is over 10,000 can be electrically connected. Die share tests have revealed that bonding strength can be increased to the strength that bonding at 150°C provides.

Original language	English
Title of host publication	Proceedings of 2012 3rd IEEE International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2012
Pages	167-170
Number of pages	4
DOIs	https://doi.org/10.1109/LTB-3D.2012.6238081
Publication status	Published - Aug 15 2012
Event	2012 3rd IEEE International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2012 - Tokyo, Japan Duration: May 22 2012 → May 23 2012

Publication series

Name	Proceedings of 2012 3rd IEEE International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2012

Other

Other	2012 3rd IEEE International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2012
Country/Territory	Japan
City	Tokyo
Period	5/22/12 → 5/23/12

All Science Journal Classification (ASJC) codes

Computer Graphics and Computer-Aided Design
Computer Vision and Pattern Recognition

Access to Document

10.1109/LTB-3D.2012.6238081

Cite this

Iwanabe, K., Shuto, T., Noda, K., Nakai, S., & Asano, T. (2012). Room-temperature microjoining using ultrasonic bonding of compliant bump. In Proceedings of 2012 3rd IEEE International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2012 (pp. 167-170). [6238081] (Proceedings of 2012 3rd IEEE International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2012). https://doi.org/10.1109/LTB-3D.2012.6238081

Room-temperature microjoining using ultrasonic bonding of compliant bump. / Iwanabe, Keiichiro; Shuto, Takanori; Noda, Kazuhiro et al.
Proceedings of 2012 3rd IEEE International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2012. 2012. p. 167-170 6238081 (Proceedings of 2012 3rd IEEE International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2012).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Iwanabe, K, Shuto, T, Noda, K, Nakai, S & Asano, T 2012, Room-temperature microjoining using ultrasonic bonding of compliant bump. in Proceedings of 2012 3rd IEEE International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2012., 6238081, Proceedings of 2012 3rd IEEE International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2012, pp. 167-170, 2012 3rd IEEE International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2012, Tokyo, Japan, 5/22/12. https://doi.org/10.1109/LTB-3D.2012.6238081

Iwanabe K, Shuto T, Noda K, Nakai S, Asano T. Room-temperature microjoining using ultrasonic bonding of compliant bump. In Proceedings of 2012 3rd IEEE International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2012. 2012. p. 167-170. 6238081. (Proceedings of 2012 3rd IEEE International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2012). doi: 10.1109/LTB-3D.2012.6238081

Iwanabe, Keiichiro ; Shuto, Takanori ; Noda, Kazuhiro et al. / Room-temperature microjoining using ultrasonic bonding of compliant bump. Proceedings of 2012 3rd IEEE International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2012. 2012. pp. 167-170 (Proceedings of 2012 3rd IEEE International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2012).

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Room-temperature microjoining using ultrasonic bonding of compliant bump

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