Room-temperature microjoining using ultrasonic bonding of compliant bump

Keiichiro Iwanabe, Takanori Shuto, Kazuhiro Noda, Seiya Nakai, Tanemasa Asano

Research output: Chapter in Book/Report/Conference proceedingConference contribution

12 Citations (Scopus)

Abstract

Ultrasonic bonding was applied to cone-shaped microbump made of Au on a Si chip to perform bonding at room temperature. Array of cone-shaped microbump having 10 m in diameter and 20μm in pitch was formed on Si using photolithography and electroplating. The counter electrode was a planar electrode which was also made by using electroplating of Au. Bonding was carried out at room temperature under conventional air circumstances. It has been found that bump array whose number is over 10,000 can be electrically connected. Die share tests have revealed that bonding strength can be increased to the strength that bonding at 150°C provides.

Original languageEnglish
Title of host publicationProceedings of 2012 3rd IEEE International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2012
Pages167-170
Number of pages4
DOIs
Publication statusPublished - Aug 15 2012
Event2012 3rd IEEE International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2012 - Tokyo, Japan
Duration: May 22 2012May 23 2012

Publication series

NameProceedings of 2012 3rd IEEE International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2012

Other

Other2012 3rd IEEE International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2012
CountryJapan
CityTokyo
Period5/22/125/23/12

All Science Journal Classification (ASJC) codes

  • Computer Graphics and Computer-Aided Design
  • Computer Vision and Pattern Recognition

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