Room-temperature ultrasonic-bonding characteristics of compliant micro-bump investigated by ex-situ and in-situ measurements

Keiichiro Iwanabe, Kenichi Nakadozono, Yosuke Senda, Tanemasa Asano

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

Room temperature microjoining of Au-Au or Cu-Cu bumps in the air ambient has been achieved by using the cone-shaped bumps with ultrasonic assist. This paper reports bonding mechanism investigated from the results of ex-situ and in-situ measurements. As an ex-situ measurement, we firstly investigate effect of the application of ultrasonic vibration on magnitude of plastic deformation of the compliant bump. We show that "softening" of the bumps take place under the application of ultrasonic vibration. Second, change in crystal texture near the bonded interface was analyzed to clarify how the ultrasonic bonding produce bonded interface at room-temperature. As an in-situ measurement, dynamic strain generated under the bonding pad is measured by using a strain gauge made of Si.

Original languageEnglish
Title of host publication2015 IEEE 17th Electronics Packaging and Technology Conference, EPTC 2015
PublisherInstitute of Electrical and Electronics Engineers Inc.
ISBN (Electronic)9781467372688
DOIs
Publication statusPublished - Feb 17 2016
Event17th IEEE Electronics Packaging and Technology Conference, EPTC 2015 - Singapore, Singapore
Duration: Dec 2 2015Dec 4 2015

Publication series

NameProceedings of the Electronic Packaging Technology Conference, EPTC
Volume2016-February

Other

Other17th IEEE Electronics Packaging and Technology Conference, EPTC 2015
CountrySingapore
CitySingapore
Period12/2/1512/4/15

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All Science Journal Classification (ASJC) codes

  • Electrical and Electronic Engineering
  • Electronic, Optical and Magnetic Materials
  • Condensed Matter Physics

Cite this

Iwanabe, K., Nakadozono, K., Senda, Y., & Asano, T. (2016). Room-temperature ultrasonic-bonding characteristics of compliant micro-bump investigated by ex-situ and in-situ measurements. In 2015 IEEE 17th Electronics Packaging and Technology Conference, EPTC 2015 [7412363] (Proceedings of the Electronic Packaging Technology Conference, EPTC; Vol. 2016-February). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/EPTC.2015.7412363