Room-temperature vacuum packaging using ultrasonic bonding with Cu compliant rim

Ryo Takigawa, Hiroki Kawano, Takanori Shuto, Akihiro Ikeda, Takayuki Takao, Tanemasa Asano

Research output: Chapter in Book/Report/Conference proceedingConference contribution

3 Citations (Scopus)

Abstract

In this study, we demonstrate room-temperature vacuum sealing by combining Cu compliant rim with ultrasonic assist.

Original languageEnglish
Title of host publicationProceedings of 2014 4th IEEE International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2014
PublisherIEEE Computer Society
Number of pages1
ISBN (Print)9781479952618
DOIs
Publication statusPublished - Jan 1 2014
Event2014 4th IEEE International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2014 - Tokyo, Japan
Duration: Jul 15 2014Jul 16 2014

Publication series

NameProceedings of 2014 4th IEEE International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2014

Other

Other2014 4th IEEE International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2014
CountryJapan
CityTokyo
Period7/15/147/16/14

All Science Journal Classification (ASJC) codes

  • Filtration and Separation

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