Room-temperature wafer bonding of LiNbO3 and SiO2 using a modified surface activated bonding method

Ryo Takigawa, Eiji Higurashi, Tanemasa Asano

Research output: Contribution to journalArticle

11 Citations (Scopus)

Abstract

In this paper, we report room-temperature bonding of LiNbO3 (LN) and SiO2/Si for the realization of a LN on insulator (LNOI)/Si hybrid wafer. We investigate the applicability of a modified surface activated bonding (SAB) method for the direct bonding of LN and a thermally grown SiO2 layer. The modified SAB method using ion beam bombardment demonstrates the room-temperature wafer bonding of LN and SiO2. The bonded wafer was successfully cut into 0.5 × 0.5mm2 dies without interfacial debonding owing to the applied stress during dicing. In addition, the surface energy of the bonded wafer was estimated to be approximately 1.8 J/m2 using the crack opening method. These results indicate that a strong bond strength can be achieved, which may be sufficient for device applications.

Original languageEnglish
Article number06HJ12
JournalJapanese Journal of Applied Physics
Volume57
Issue number6
DOIs
Publication statusPublished - Jun 2018

Fingerprint

Wafer bonding
wafers
room temperature
Temperature
Debonding
Interfacial energy
Ion beams
surface energy
bombardment
Cracks
cracks
ion beams
insulators

All Science Journal Classification (ASJC) codes

  • Engineering(all)
  • Physics and Astronomy(all)

Cite this

Room-temperature wafer bonding of LiNbO3 and SiO2 using a modified surface activated bonding method. / Takigawa, Ryo; Higurashi, Eiji; Asano, Tanemasa.

In: Japanese Journal of Applied Physics, Vol. 57, No. 6, 06HJ12, 06.2018.

Research output: Contribution to journalArticle

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