The application of secondary ion mass spectroscopy (SIMS) for the interfacial analysis of copper migration at Cu/polyimide bilayer. The polyamic acid was coated on the Cu substrate and the bilayer was then cured. Copper was found to deeply migrate into the polyimide across its interface. However, the migration phenomena was not detected during vapor deposition of Cu onto the plastic film. Thus, preparation of the bilayer strongly affects Cu migration behavior.
|Number of pages||4|
|Journal||Journal of Vacuum Science and Technology B: Microelectronics and Nanometer Structures|
|Publication status||Published - Jan 2000|
All Science Journal Classification (ASJC) codes
- Condensed Matter Physics
- Electrical and Electronic Engineering