Secondary ion mass spectroscopic analysis of copper migration at the copper/polyimide interface

Norihiko Miki, Keiji Tanaka, Atsushi Takahara, Tisato Kajiyama

Research output: Contribution to journalArticlepeer-review

6 Citations (Scopus)

Abstract

The application of secondary ion mass spectroscopy (SIMS) for the interfacial analysis of copper migration at Cu/polyimide bilayer. The polyamic acid was coated on the Cu substrate and the bilayer was then cured. Copper was found to deeply migrate into the polyimide across its interface. However, the migration phenomena was not detected during vapor deposition of Cu onto the plastic film. Thus, preparation of the bilayer strongly affects Cu migration behavior.

Original languageEnglish
Pages (from-to)313-316
Number of pages4
JournalJournal of Vacuum Science and Technology B: Microelectronics and Nanometer Structures
Volume18
Issue number1
DOIs
Publication statusPublished - Jan 2000

All Science Journal Classification (ASJC) codes

  • Condensed Matter Physics
  • Electrical and Electronic Engineering

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