SEM-CT observation of bone from mice using environmental-SEM

Masahiro Nakajima, Masaru Takeuchi, Taisuke Masuda, Takahisa Anada, Osamu Suzuki, Toshio Fukuda, Qiang Huang, Yasuhisa Hasegawa

Research output: Chapter in Book/Report/Conference proceedingConference contribution

1 Citation (Scopus)

Abstract

Computer topography (CT) imaging is one of the powerful-tools for nondestructive observation technique. In this paper, we present observation of bone from mice by scanning electron microscope (SEM)-CT system using environmental- SEM (E-SEM). The advantage of this SEM-CT system is able to image in high-resolution with less than 400 nm resolution. We investigated the effects of X-ray wavelengths and intensities to improve the imaging contrast for SEM-CT observation. From experimental results, a porous structures were observed inside the bone sample with approximately 10 μm pores.

Original languageEnglish
Title of host publication2014 International Symposium on Micro-NanoMechatronics and Human Science, MHS 2014
PublisherInstitute of Electrical and Electronics Engineers Inc.
ISBN (Electronic)9781479966790
DOIs
Publication statusPublished - Jan 9 2015
Externally publishedYes
Event2014 International Symposium on Micro-NanoMechatronics and Human Science, MHS 2014 - Nagoya, Japan
Duration: Nov 10 2014Nov 12 2014

Publication series

Name2014 International Symposium on Micro-NanoMechatronics and Human Science, MHS 2014

Other

Other2014 International Symposium on Micro-NanoMechatronics and Human Science, MHS 2014
CountryJapan
CityNagoya
Period11/10/1411/12/14

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All Science Journal Classification (ASJC) codes

  • Electrical and Electronic Engineering
  • Mechanical Engineering

Cite this

Nakajima, M., Takeuchi, M., Masuda, T., Anada, T., Suzuki, O., Fukuda, T., ... Hasegawa, Y. (2015). SEM-CT observation of bone from mice using environmental-SEM. In 2014 International Symposium on Micro-NanoMechatronics and Human Science, MHS 2014 [7006069] (2014 International Symposium on Micro-NanoMechatronics and Human Science, MHS 2014). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/MHS.2014.7006069