Semiconductor device cleaning with liquid aerosol nozzle using rotary atomizer method

Yoshiyuki Seike, Keiji Miyachi, Syuhei Kurokawa, Osamu Ohnishi, Toshiro Doi

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

A liquid aerosol, which sprays cleaning liquid with a carrier gas, is widely used for cleaning semiconductor devices. The liquid aerosol using a conventional two-fluid nozzle may cause pattern damage on the wafer. To resolve this problem, we have made a prototype new rotary atomizing two-fluid cleaning nozzle (RAC nozzle), which can control the velocity distribution and size distribution of flying liquid droplets separately. It could be atomized to 20 μm or less at a rotational speed of the air turbine of 50,000 min -1 and that the mean velocity of the flying liquid droplets could be controlled in the range under 65 m/s independently. It was confirmed in a cleaning experiment using polystyrene latex (PSL) particles on a wafer that particle removal efficiency increased when shaping air pressure increased. Also, the particle removal efficiency was improved with the finer atomization promoted by a higher rotational speed of the air turbine.

Original languageEnglish
Title of host publicationAdvanced Metallization Conference 2010
Pages296-297
Number of pages2
Publication statusPublished - Dec 1 2010
EventAdvanced Metallization Conference 2010 - Albany, NY, United States
Duration: Oct 5 2010Oct 7 2010

Publication series

NameAdvanced Metallization Conference (AMC)
ISSN (Print)1540-1766

Other

OtherAdvanced Metallization Conference 2010
Country/TerritoryUnited States
CityAlbany, NY
Period10/5/1010/7/10

All Science Journal Classification (ASJC) codes

  • Materials Science(all)
  • Industrial and Manufacturing Engineering

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