TY - GEN
T1 - Sensing local dynamic strain and temperature evolution during ultrasonic bonding of microbumps
AU - Nakadozono, Kenichi
AU - Iwanabe, Keiichiro
AU - Senda, Yousuke
AU - Asano, Tanemasa
PY - 2016/12/1
Y1 - 2016/12/1
N2 - We have developed a strain gauge sensor to measure two axial dynamic strain and temperature evolution during ultrasonic flip-chip bonding. The sensor detects strain from change in resistance due to the piezoresistance effect of Si and temperature from change in current-voltage characteristics of pn-junction. The spatial resolution of the sensor is 20 μm. Au planar microbumps were used for the measurement. The number of bumps in the test chip was 12100. The measurement results of dynamic strain indicated the generation of a large strain at the initial stage of ultrasonic vibration. On the other hand, rise in temperature up to only a few degrees was observed during the ultrasonic vibration. Therefore, the damage is considered to be generated by mechanical strain at the initial stage of ultrasonic vibration. The sensing method and results will contribute to improving the reliability of three dimensionally integrated electronic devices.
AB - We have developed a strain gauge sensor to measure two axial dynamic strain and temperature evolution during ultrasonic flip-chip bonding. The sensor detects strain from change in resistance due to the piezoresistance effect of Si and temperature from change in current-voltage characteristics of pn-junction. The spatial resolution of the sensor is 20 μm. Au planar microbumps were used for the measurement. The number of bumps in the test chip was 12100. The measurement results of dynamic strain indicated the generation of a large strain at the initial stage of ultrasonic vibration. On the other hand, rise in temperature up to only a few degrees was observed during the ultrasonic vibration. Therefore, the damage is considered to be generated by mechanical strain at the initial stage of ultrasonic vibration. The sensing method and results will contribute to improving the reliability of three dimensionally integrated electronic devices.
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U2 - 10.1109/ESTC.2016.7764714
DO - 10.1109/ESTC.2016.7764714
M3 - Conference contribution
AN - SCOPUS:85015050703
T3 - 2016 6th Electronic System-Integration Technology Conference, ESTC 2016
BT - 2016 6th Electronic System-Integration Technology Conference, ESTC 2016
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 6th Electronic System-Integration Technology Conference, ESTC 2016
Y2 - 13 September 2016 through 16 September 2016
ER -