Sensing local dynamic strain and temperature evolution during ultrasonic bonding of microbumps

Kenichi Nakadozono, Keiichiro Iwanabe, Yousuke Senda, Tanemasa Asano

Research output: Chapter in Book/Report/Conference proceedingConference contribution

3 Citations (Scopus)

Abstract

We have developed a strain gauge sensor to measure two axial dynamic strain and temperature evolution during ultrasonic flip-chip bonding. The sensor detects strain from change in resistance due to the piezoresistance effect of Si and temperature from change in current-voltage characteristics of pn-junction. The spatial resolution of the sensor is 20 μm. Au planar microbumps were used for the measurement. The number of bumps in the test chip was 12100. The measurement results of dynamic strain indicated the generation of a large strain at the initial stage of ultrasonic vibration. On the other hand, rise in temperature up to only a few degrees was observed during the ultrasonic vibration. Therefore, the damage is considered to be generated by mechanical strain at the initial stage of ultrasonic vibration. The sensing method and results will contribute to improving the reliability of three dimensionally integrated electronic devices.

Original languageEnglish
Title of host publication2016 6th Electronic System-Integration Technology Conference, ESTC 2016
PublisherInstitute of Electrical and Electronics Engineers Inc.
ISBN (Electronic)9781509014026
DOIs
Publication statusPublished - Dec 1 2016
Event6th Electronic System-Integration Technology Conference, ESTC 2016 - Grenoble, France
Duration: Sep 13 2016Sep 16 2016

Publication series

Name2016 6th Electronic System-Integration Technology Conference, ESTC 2016

Other

Other6th Electronic System-Integration Technology Conference, ESTC 2016
CountryFrance
CityGrenoble
Period9/13/169/16/16

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All Science Journal Classification (ASJC) codes

  • Electronic, Optical and Magnetic Materials
  • Hardware and Architecture
  • Electrical and Electronic Engineering

Cite this

Nakadozono, K., Iwanabe, K., Senda, Y., & Asano, T. (2016). Sensing local dynamic strain and temperature evolution during ultrasonic bonding of microbumps. In 2016 6th Electronic System-Integration Technology Conference, ESTC 2016 [7764714] (2016 6th Electronic System-Integration Technology Conference, ESTC 2016). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/ESTC.2016.7764714