Silicon wafer cleaning using new liquid aerosol with controlled droplet velocity and size by rotary atomizer method

Yoshiyuki Seike, Keiji Miyachi, Tatsuo Shibata, Yoshinori Kobayashi, Syuhei Kurokawa, Toshiro Doi

Research output: Contribution to journalArticle

11 Citations (Scopus)


A liquid aerosol, which sprays cleaning liquid with a carrier gas, is widely used for cleaning semiconductor devices. The liquid aerosol using a conventional two-fluid nozzle may cause pattern damage on the wafer. To resolve this problem, we have made a prototype new rotary atomizing two-fluid cleaning nozzle (RAC nozzle), which can control the velocity distribution and size distribution of flying liquid droplets separately. It was confirmed by measuring flying liquid droplets using a shadow Doppler particle analyzer system that the mean volumetric diameter of the droplets could be atomized to 20 μm or less at a rotational speed of the air turbine of 50,000 min-1 and that the mean velocity of the flying liquid droplets could be controlled in the range under 65 m/s independently. It was confirmed in a cleaning experiment using polystyrene latex (PSL) particles on a wafer that particle removal efficiency increased when shaping air pressure increased. Also, the particle removal efficiency was improved with the finer atomization promoted by a higher rotational speed of the air turbine.

Original languageEnglish
Pages (from-to)667011-667016
Number of pages6
JournalJapanese journal of applied physics
Issue number6 PART 1
Publication statusPublished - Jun 1 2010


All Science Journal Classification (ASJC) codes

  • Engineering(all)
  • Physics and Astronomy(all)

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