Abstract
A liquid aerosol, which sprays cleaning liquid with a carrier gas, is widely used for cleaning semiconductor devices. The liquid aerosol using a conventional two-fluid nozzle may cause pattern damage on the wafer. To resolve this problem, we have made a prototype new rotary atomizing two-fluid cleaning nozzle (RAC nozzle), which can control the velocity distribution and size distribution of flying liquid droplets separately. It was confirmed by measuring flying liquid droplets using a shadow Doppler particle analyzer system that the mean volumetric diameter of the droplets could be atomized to 20 μm or less at a rotational speed of the air turbine of 50,000 min-1 and that the mean velocity of the flying liquid droplets could be controlled in the range under 65 m/s independently. It was confirmed in a cleaning experiment using polystyrene latex (PSL) particles on a wafer that particle removal efficiency increased when shaping air pressure increased. Also, the particle removal efficiency was improved with the finer atomization promoted by a higher rotational speed of the air turbine.
| Original language | English |
|---|---|
| Pages (from-to) | 667011-667016 |
| Number of pages | 6 |
| Journal | Japanese Journal of Applied Physics |
| Volume | 49 |
| Issue number | 6 PART 1 |
| DOIs | |
| Publication status | Published - Jun 1 2010 |
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All Science Journal Classification (ASJC) codes
- Engineering(all)
- Physics and Astronomy(all)
Cite this
Silicon wafer cleaning using new liquid aerosol with controlled droplet velocity and size by rotary atomizer method. / Seike, Yoshiyuki; Miyachi, Keiji; Shibata, Tatsuo; Kobayashi, Yoshinori; Kurokawa, Syuhei; Doi, Toshiro.
In: Japanese Journal of Applied Physics, Vol. 49, No. 6 PART 1, 01.06.2010, p. 667011-667016.Research output: Contribution to journal › Article
}
TY - JOUR
T1 - Silicon wafer cleaning using new liquid aerosol with controlled droplet velocity and size by rotary atomizer method
AU - Seike, Yoshiyuki
AU - Miyachi, Keiji
AU - Shibata, Tatsuo
AU - Kobayashi, Yoshinori
AU - Kurokawa, Syuhei
AU - Doi, Toshiro
PY - 2010/6/1
Y1 - 2010/6/1
N2 - A liquid aerosol, which sprays cleaning liquid with a carrier gas, is widely used for cleaning semiconductor devices. The liquid aerosol using a conventional two-fluid nozzle may cause pattern damage on the wafer. To resolve this problem, we have made a prototype new rotary atomizing two-fluid cleaning nozzle (RAC nozzle), which can control the velocity distribution and size distribution of flying liquid droplets separately. It was confirmed by measuring flying liquid droplets using a shadow Doppler particle analyzer system that the mean volumetric diameter of the droplets could be atomized to 20 μm or less at a rotational speed of the air turbine of 50,000 min-1 and that the mean velocity of the flying liquid droplets could be controlled in the range under 65 m/s independently. It was confirmed in a cleaning experiment using polystyrene latex (PSL) particles on a wafer that particle removal efficiency increased when shaping air pressure increased. Also, the particle removal efficiency was improved with the finer atomization promoted by a higher rotational speed of the air turbine.
AB - A liquid aerosol, which sprays cleaning liquid with a carrier gas, is widely used for cleaning semiconductor devices. The liquid aerosol using a conventional two-fluid nozzle may cause pattern damage on the wafer. To resolve this problem, we have made a prototype new rotary atomizing two-fluid cleaning nozzle (RAC nozzle), which can control the velocity distribution and size distribution of flying liquid droplets separately. It was confirmed by measuring flying liquid droplets using a shadow Doppler particle analyzer system that the mean volumetric diameter of the droplets could be atomized to 20 μm or less at a rotational speed of the air turbine of 50,000 min-1 and that the mean velocity of the flying liquid droplets could be controlled in the range under 65 m/s independently. It was confirmed in a cleaning experiment using polystyrene latex (PSL) particles on a wafer that particle removal efficiency increased when shaping air pressure increased. Also, the particle removal efficiency was improved with the finer atomization promoted by a higher rotational speed of the air turbine.
UR - http://www.scopus.com/inward/record.url?scp=77955310870&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=77955310870&partnerID=8YFLogxK
U2 - 10.1143/JJAP.49.066701
DO - 10.1143/JJAP.49.066701
M3 - Article
AN - SCOPUS:77955310870
VL - 49
SP - 667011
EP - 667016
JO - Japanese Journal of Applied Physics, Part 1: Regular Papers & Short Notes
JF - Japanese Journal of Applied Physics, Part 1: Regular Papers & Short Notes
SN - 0021-4922
IS - 6 PART 1
ER -