Simulating underfill flow for microelectronics packaging

N. Iwamoto, Masami Nakagawa, G. G.W. Mustoe

Research output: Contribution to journalConference article

9 Citations (Scopus)

Abstract

Two types of dynamic modeling are initiated to understand formulation constituent effects. The two modeling types include molecular modeling and discrete element modeling. Through this modelling effort, a basic model of underfill flow which includes particle, binder (or carrier) and surface effects is constructed.

Original languageEnglish
Pages (from-to)294-301
Number of pages8
JournalProceedings - Electronic Components and Technology Conference
Publication statusPublished - Jan 1 1999
Externally publishedYes
EventProceedings of the 1999 49th Electronic Components and Technology Conference (ECTC) - San Diego, CA, USA
Duration: Jun 1 1999Jun 4 1999

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Molecular modeling
Microelectronics
Binders
Packaging

All Science Journal Classification (ASJC) codes

  • Electronic, Optical and Magnetic Materials
  • Electrical and Electronic Engineering

Cite this

Simulating underfill flow for microelectronics packaging. / Iwamoto, N.; Nakagawa, Masami; Mustoe, G. G.W.

In: Proceedings - Electronic Components and Technology Conference, 01.01.1999, p. 294-301.

Research output: Contribution to journalConference article

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