Simulation of fracture behavior of unidirectional sic/sic composite exposed in air at 823–1673 k

K. Morishita, S. Ochiai, H. Okuda, H. Nakayama, M. Sato

Research output: Contribution to journalArticle

2 Citations (Scopus)

Abstract

It is known that SiC/SiC composite has high strength and toughness, but is degraded when exposed in air at high temperatures due to the propagation of the crack made by the premature fracture of the SiO2 layer. It is also known that the fracture morphology of this composite varies from fiber pull-out type to non pull-out type with progressing oxidation. The present work aimed to describe such a behavior with a computer-aided Monte Carlo shear lag simulation method. The experimentally measured variation of strength of the unidirectional composite as a function of thickness of the SiO2 layer and also as a function of exposure time and temperature, and the experimentally observed variation of fracture morphology with progressing oxidation, could be reproduced satisfactorily by this method.

Original languageEnglish
Pages (from-to)693-706
Number of pages14
JournalComposite Interfaces
Volume12
Issue number8-9
DOIs
Publication statusPublished - Jan 1 2005

Fingerprint

composite materials
air
Composite materials
Air
Oxidation
oxidation
simulation
toughness
high strength
Toughness
Crack propagation
time lag
cracks
shear
Cracks
Temperature
fibers
propagation
Fibers
temperature

All Science Journal Classification (ASJC) codes

  • Ceramics and Composites
  • Physics and Astronomy(all)
  • Surfaces, Coatings and Films

Cite this

Simulation of fracture behavior of unidirectional sic/sic composite exposed in air at 823–1673 k. / Morishita, K.; Ochiai, S.; Okuda, H.; Nakayama, H.; Sato, M.

In: Composite Interfaces, Vol. 12, No. 8-9, 01.01.2005, p. 693-706.

Research output: Contribution to journalArticle

Morishita, K. ; Ochiai, S. ; Okuda, H. ; Nakayama, H. ; Sato, M. / Simulation of fracture behavior of unidirectional sic/sic composite exposed in air at 823–1673 k. In: Composite Interfaces. 2005 ; Vol. 12, No. 8-9. pp. 693-706.
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