Simulation of particle compaction for conductive adhesives using discrete element modeling

G. G.W. Mustoe, Masami Nakagawa, X. Lin, N. Iwamoto

Research output: Contribution to journalConference article

12 Citations (Scopus)

Abstract

Johnson-Matthey and Colorado School of Mines collaborated on the simulation of compaction in conductive die attach adhesives using Discrete Element Modeling (DEM). It was found that by using DEM, both particle shape and distribution may be simulated to derive an overall picture of the settled or compacted state of the material.

Original languageEnglish
Pages (from-to)353-359
Number of pages7
JournalProceedings - Electronic Components and Technology Conference
Publication statusPublished - Jan 1 1999
Externally publishedYes
EventProceedings of the 1999 49th Electronic Components and Technology Conference (ECTC) - San Diego, CA, USA
Duration: Jun 1 1999Jun 4 1999

All Science Journal Classification (ASJC) codes

  • Electronic, Optical and Magnetic Materials
  • Electrical and Electronic Engineering

Fingerprint Dive into the research topics of 'Simulation of particle compaction for conductive adhesives using discrete element modeling'. Together they form a unique fingerprint.

  • Cite this