Simultaneous molding and low-temperature bonding of Au microstructures for fabrication of micromirrors on non-silicon substrates

Seiya Matsuoka, Eiji Higurashi, Tadatomo Suga, Renshi Sawada

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

In order to realize micromirrors on non-silicon substrates, low-temperature bonding method of Au microrods (diameter: 100-130 μm) using glass molds is presented. First, a target substrate with an Au thin film and the Au microrod were surface activated using hydrogen plasma. Then, the Au microrod was pressed against the target substrate using the glass mold at 150 °C in ambient air. The Au microrod was plastically deformed and smooth surface (11 nm rms) was successfully fabricated on the Au microrod. Using the glass as the mold material, molding and Au-Au bonding were performed in one processing step.

Original languageEnglish
Title of host publication2016 International Conference on Optical MEMS and Nanophotonics, OMN 2016 - Proceedings
PublisherIEEE Computer Society
Volume2016-September
ISBN (Electronic)9781509010356
DOIs
Publication statusPublished - Sep 13 2016
Event21st International Conference on Optical MEMS and Nanophotonics, OMN 2016 - Singapore, Singapore
Duration: Jul 31 2016Aug 4 2016

Other

Other21st International Conference on Optical MEMS and Nanophotonics, OMN 2016
CountrySingapore
CitySingapore
Period7/31/168/4/16

Fingerprint

Molding
Fabrication
Glass
Microstructure
Substrates
Molds
Temperature
Hydrogen
Plasmas
Thin films
Processing
Air

All Science Journal Classification (ASJC) codes

  • Hardware and Architecture
  • Electrical and Electronic Engineering
  • Electronic, Optical and Magnetic Materials

Cite this

Matsuoka, S., Higurashi, E., Suga, T., & Sawada, R. (2016). Simultaneous molding and low-temperature bonding of Au microstructures for fabrication of micromirrors on non-silicon substrates. In 2016 International Conference on Optical MEMS and Nanophotonics, OMN 2016 - Proceedings (Vol. 2016-September). [7565926] IEEE Computer Society. https://doi.org/10.1109/OMN.2016.7565926

Simultaneous molding and low-temperature bonding of Au microstructures for fabrication of micromirrors on non-silicon substrates. / Matsuoka, Seiya; Higurashi, Eiji; Suga, Tadatomo; Sawada, Renshi.

2016 International Conference on Optical MEMS and Nanophotonics, OMN 2016 - Proceedings. Vol. 2016-September IEEE Computer Society, 2016. 7565926.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Matsuoka, S, Higurashi, E, Suga, T & Sawada, R 2016, Simultaneous molding and low-temperature bonding of Au microstructures for fabrication of micromirrors on non-silicon substrates. in 2016 International Conference on Optical MEMS and Nanophotonics, OMN 2016 - Proceedings. vol. 2016-September, 7565926, IEEE Computer Society, 21st International Conference on Optical MEMS and Nanophotonics, OMN 2016, Singapore, Singapore, 7/31/16. https://doi.org/10.1109/OMN.2016.7565926
Matsuoka S, Higurashi E, Suga T, Sawada R. Simultaneous molding and low-temperature bonding of Au microstructures for fabrication of micromirrors on non-silicon substrates. In 2016 International Conference on Optical MEMS and Nanophotonics, OMN 2016 - Proceedings. Vol. 2016-September. IEEE Computer Society. 2016. 7565926 https://doi.org/10.1109/OMN.2016.7565926
Matsuoka, Seiya ; Higurashi, Eiji ; Suga, Tadatomo ; Sawada, Renshi. / Simultaneous molding and low-temperature bonding of Au microstructures for fabrication of micromirrors on non-silicon substrates. 2016 International Conference on Optical MEMS and Nanophotonics, OMN 2016 - Proceedings. Vol. 2016-September IEEE Computer Society, 2016.
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