Simultaneous molding and low-temperature bonding of Au microstructures for fabrication of micromirrors on non-silicon substrates

Seiya Matsuoka, Eiji Higurashi, Tadatomo Suga, Renshi Sawada

    Research output: Chapter in Book/Report/Conference proceedingConference contribution

    Abstract

    In order to realize micromirrors on non-silicon substrates, low-temperature bonding method of Au microrods (diameter: 100-130 μm) using glass molds is presented. First, a target substrate with an Au thin film and the Au microrod were surface activated using hydrogen plasma. Then, the Au microrod was pressed against the target substrate using the glass mold at 150 °C in ambient air. The Au microrod was plastically deformed and smooth surface (11 nm rms) was successfully fabricated on the Au microrod. Using the glass as the mold material, molding and Au-Au bonding were performed in one processing step.

    Original languageEnglish
    Title of host publication2016 International Conference on Optical MEMS and Nanophotonics, OMN 2016 - Proceedings
    PublisherIEEE Computer Society
    ISBN (Electronic)9781509010356
    DOIs
    Publication statusPublished - Sep 13 2016
    Event21st International Conference on Optical MEMS and Nanophotonics, OMN 2016 - Singapore, Singapore
    Duration: Jul 31 2016Aug 4 2016

    Publication series

    NameInternational Conference on Optical MEMS and Nanophotonics
    Volume2016-September
    ISSN (Print)2160-5033
    ISSN (Electronic)2160-5041

    Other

    Other21st International Conference on Optical MEMS and Nanophotonics, OMN 2016
    Country/TerritorySingapore
    CitySingapore
    Period7/31/168/4/16

    All Science Journal Classification (ASJC) codes

    • Hardware and Architecture
    • Electrical and Electronic Engineering
    • Electronic, Optical and Magnetic Materials

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