Solid-Phase Crystallization Characteristics of Interface-Modulated Sn- Doped Ge Thin Films on Insulator with Capping

Takaya Nagano, Ryutaro Hara, Taizoh Sadoh

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

Thin poly-Ge films (thickness: ≤ 50 nm) having high carrier mobility are required for advanced thin-film devices. However, carrier mobility of poly-Ge films obtained by conventional solid-phase crystallization (SPC) significantly decreases with decreasing thickness below 50 nm. To solve this problem, we develop an interface-modulated SPC of Sn-doped Ge combined with a-Si capping. In the present study, we investigate growth characteristics of a-Si capped Sn-doped Ge films on insulator. It is clarified that a-Si capping enhances SPC of Sn-doped Ge films and results in large crystal grains, which improves the carrier mobility of Sn-doped Ge thin films. This technique will be useful to realize advanced thin-film devices for next-generation electronics.

Original languageEnglish
Title of host publicationProceedings of AM-FPD 2022 - 29th International Workshop on Active-Matrix Flatpanel Displays and Devices
Subtitle of host publicationTFT Technologies and FPD Materials
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages114-115
Number of pages2
ISBN (Electronic)9784991216923
DOIs
Publication statusPublished - 2022
Event29th International Workshop on Active-Matrix Flatpanel Displays and Devices: TFT Technologies and FPD Materials, AM-FPD 2022 - Kyoto, Japan
Duration: Jul 5 2022Jul 8 2022

Publication series

NameProceedings of AM-FPD 2022 - 29th International Workshop on Active-Matrix Flatpanel Displays and Devices: TFT Technologies and FPD Materials

Conference

Conference29th International Workshop on Active-Matrix Flatpanel Displays and Devices: TFT Technologies and FPD Materials, AM-FPD 2022
Country/TerritoryJapan
CityKyoto
Period7/5/227/8/22

All Science Journal Classification (ASJC) codes

  • Hardware and Architecture
  • Electrical and Electronic Engineering
  • Media Technology
  • Instrumentation

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