High resolution time-resolved X-ray imaging with synchrotron radiation was used for in situ observation of four distinct events during solidification of a Sn-0.7Cu-0.15Zn solder despite small composition and density differences. These included bSn dendrite growth, Sn-Cu6Sn5 univariant eutectic growth, microporosity formation, and a polyphase reaction in the last stages of freezing. The development of microstructure was described quantitatively by tracking the loci of dendrite tips during grain growth. The results have implications for microstructure control and the understanding of structure-property relationships in Sn-Cu-Zn lead-free solders.
|Number of pages||9|
|Journal||Metallurgical and Materials Transactions A: Physical Metallurgy and Materials Science|
|Publication status||Published - Feb 1 2014|
All Science Journal Classification (ASJC) codes
- Condensed Matter Physics
- Mechanics of Materials
- Metals and Alloys