Solidification of Sn-3Ag-0.5Cu and sn-0.7Cu-0.05Ni solders

C. M. Gourlay, Z. L. Ma, J. W. Xian, S. A. Belyakov, M. A.A. Mohd Salleh, G. Zeng, H. Yasuda, K. Nogita

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

The solidification of Sn-3Ag-0.5Cu and Sn-0.7Cu-0.05Ni are overviewed and compared. In joints on Cu substrates, both solders begin solidification with primary Cu6Sn5 growing in the bulk liquid prior to tin nucleation. In freestanding balls and joints, SAC305 generally solidifies with a single tin nucleation event and exhibits a mutually-twinned tin grain structure. In contrast, SN100C BGA balls and joints exhibit multiple independent tin grains that grow as a columnar array in joints.

Original languageEnglish
Title of host publicationAdvanced Materials Engineering and Technology IV
EditorsMohd Mustafa Al Bakri Abdullah, Rafiza Abd Razak, Muhammad Faheem Mohd Tahir, Mohd Mustafa Al Bakri Abdullah, Rafiza Abd Razak, Liyana Jamaludin
PublisherTrans Tech Publications Ltd
Pages44-48
Number of pages5
ISBN (Print)9783035710205
DOIs
Publication statusPublished - 2016
EventInternational Conference on Advanced Materials Engineering and Technology, ICAMET 2015 - Kaohsiung, Taiwan, Province of China
Duration: Dec 4 2015Dec 5 2015

Publication series

NameMaterials Science Forum
Volume857
ISSN (Print)0255-5476
ISSN (Electronic)1662-9752

Other

OtherInternational Conference on Advanced Materials Engineering and Technology, ICAMET 2015
CountryTaiwan, Province of China
CityKaohsiung
Period12/4/1512/5/15

All Science Journal Classification (ASJC) codes

  • Materials Science(all)
  • Condensed Matter Physics
  • Mechanics of Materials
  • Mechanical Engineering

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