Solidification of Sn-3Ag-0.5Cu and sn-0.7Cu-0.05Ni solders

C. M. Gourlay; Z. L. Ma; J. W. Xian; S. A. Belyakov; M. A.A. Mohd Salleh; G. Zeng; H. Yasuda; K. Nogita

doi:10.4028/www.scientific.net/MSF.857.44

Solidification of Sn-3Ag-0.5Cu and sn-0.7Cu-0.05Ni solders

C. M. Gourlay, Z. L. Ma, J. W. Xian, S. A. Belyakov, M. A.A. Mohd Salleh, G. Zeng, H. Yasuda, K. Nogita

Faculty of Engineering

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Abstract

The solidification of Sn-3Ag-0.5Cu and Sn-0.7Cu-0.05Ni are overviewed and compared. In joints on Cu substrates, both solders begin solidification with primary Cu6Sn5 growing in the bulk liquid prior to tin nucleation. In freestanding balls and joints, SAC305 generally solidifies with a single tin nucleation event and exhibits a mutually-twinned tin grain structure. In contrast, SN100C BGA balls and joints exhibit multiple independent tin grains that grow as a columnar array in joints.

Original language	English
Title of host publication	Advanced Materials Engineering and Technology IV
Editors	Mohd Mustafa Al Bakri Abdullah, Rafiza Abd Razak, Muhammad Faheem Mohd Tahir, Mohd Mustafa Al Bakri Abdullah, Rafiza Abd Razak, Liyana Jamaludin
Publisher	Trans Tech Publications Ltd
Pages	44-48
Number of pages	5
ISBN (Print)	9783035710205
DOIs	https://doi.org/10.4028/www.scientific.net/MSF.857.44
Publication status	Published - 2016
Event	International Conference on Advanced Materials Engineering and Technology, ICAMET 2015 - Kaohsiung, Taiwan, Province of China Duration: Dec 4 2015 → Dec 5 2015

Publication series

Name	Materials Science Forum
Volume	857
ISSN (Print)	0255-5476
ISSN (Electronic)	1662-9752

Other

Other	International Conference on Advanced Materials Engineering and Technology, ICAMET 2015
Country/Territory	Taiwan, Province of China
City	Kaohsiung
Period	12/4/15 → 12/5/15

All Science Journal Classification (ASJC) codes

Materials Science(all)
Condensed Matter Physics
Mechanics of Materials
Mechanical Engineering

Access to Document

10.4028/www.scientific.net/MSF.857.44

Cite this

Gourlay, C. M., Ma, Z. L., Xian, J. W., Belyakov, S. A., Mohd Salleh, M. A. A., Zeng, G., Yasuda, H., & Nogita, K. (2016). Solidification of Sn-3Ag-0.5Cu and sn-0.7Cu-0.05Ni solders. In M. M. Al Bakri Abdullah, R. A. Razak, M. F. M. Tahir, M. M. Al Bakri Abdullah, R. A. Razak, & L. Jamaludin (Eds.), Advanced Materials Engineering and Technology IV (pp. 44-48). (Materials Science Forum; Vol. 857). Trans Tech Publications Ltd. https://doi.org/10.4028/www.scientific.net/MSF.857.44

Solidification of Sn-3Ag-0.5Cu and sn-0.7Cu-0.05Ni solders. / Gourlay, C. M.; Ma, Z. L.; Xian, J. W. et al.

Advanced Materials Engineering and Technology IV. ed. / Mohd Mustafa Al Bakri Abdullah; Rafiza Abd Razak; Muhammad Faheem Mohd Tahir; Mohd Mustafa Al Bakri Abdullah; Rafiza Abd Razak; Liyana Jamaludin. Trans Tech Publications Ltd, 2016. p. 44-48 (Materials Science Forum; Vol. 857).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Gourlay, CM, Ma, ZL, Xian, JW, Belyakov, SA, Mohd Salleh, MAA, Zeng, G, Yasuda, H & Nogita, K 2016, Solidification of Sn-3Ag-0.5Cu and sn-0.7Cu-0.05Ni solders. in MM Al Bakri Abdullah, RA Razak, MFM Tahir, MM Al Bakri Abdullah, RA Razak & L Jamaludin (eds), Advanced Materials Engineering and Technology IV. Materials Science Forum, vol. 857, Trans Tech Publications Ltd, pp. 44-48, International Conference on Advanced Materials Engineering and Technology, ICAMET 2015, Kaohsiung, Taiwan, Province of China, 12/4/15. https://doi.org/10.4028/www.scientific.net/MSF.857.44

Gourlay CM, Ma ZL, Xian JW, Belyakov SA, Mohd Salleh MAA, Zeng G et al. Solidification of Sn-3Ag-0.5Cu and sn-0.7Cu-0.05Ni solders. In Al Bakri Abdullah MM, Razak RA, Tahir MFM, Al Bakri Abdullah MM, Razak RA, Jamaludin L, editors, Advanced Materials Engineering and Technology IV. Trans Tech Publications Ltd. 2016. p. 44-48. (Materials Science Forum). doi: 10.4028/www.scientific.net/MSF.857.44

Gourlay, C. M. ; Ma, Z. L. ; Xian, J. W. et al. / Solidification of Sn-3Ag-0.5Cu and sn-0.7Cu-0.05Ni solders. Advanced Materials Engineering and Technology IV. editor / Mohd Mustafa Al Bakri Abdullah ; Rafiza Abd Razak ; Muhammad Faheem Mohd Tahir ; Mohd Mustafa Al Bakri Abdullah ; Rafiza Abd Razak ; Liyana Jamaludin. Trans Tech Publications Ltd, 2016. pp. 44-48 (Materials Science Forum).

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abstract = "The solidification of Sn-3Ag-0.5Cu and Sn-0.7Cu-0.05Ni are overviewed and compared. In joints on Cu substrates, both solders begin solidification with primary Cu6Sn5 growing in the bulk liquid prior to tin nucleation. In freestanding balls and joints, SAC305 generally solidifies with a single tin nucleation event and exhibits a mutually-twinned tin grain structure. In contrast, SN100C BGA balls and joints exhibit multiple independent tin grains that grow as a columnar array in joints.",

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AU - Mohd Salleh, M. A.A.

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N2 - The solidification of Sn-3Ag-0.5Cu and Sn-0.7Cu-0.05Ni are overviewed and compared. In joints on Cu substrates, both solders begin solidification with primary Cu6Sn5 growing in the bulk liquid prior to tin nucleation. In freestanding balls and joints, SAC305 generally solidifies with a single tin nucleation event and exhibits a mutually-twinned tin grain structure. In contrast, SN100C BGA balls and joints exhibit multiple independent tin grains that grow as a columnar array in joints.

AB - The solidification of Sn-3Ag-0.5Cu and Sn-0.7Cu-0.05Ni are overviewed and compared. In joints on Cu substrates, both solders begin solidification with primary Cu6Sn5 growing in the bulk liquid prior to tin nucleation. In freestanding balls and joints, SAC305 generally solidifies with a single tin nucleation event and exhibits a mutually-twinned tin grain structure. In contrast, SN100C BGA balls and joints exhibit multiple independent tin grains that grow as a columnar array in joints.

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Solidification of Sn-3Ag-0.5Cu and sn-0.7Cu-0.05Ni solders

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