Solidification of Sn-3Ag-0.5Cu and sn-0.7Cu-0.05Ni solders

C. M. Gourlay, Z. L. Ma, J. W. Xian, S. A. Belyakov, M. A.A. Mohd Salleh, G. Zeng, H. Yasuda, Kazuhiro Nogita

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

The solidification of Sn-3Ag-0.5Cu and Sn-0.7Cu-0.05Ni are overviewed and compared. In joints on Cu substrates, both solders begin solidification with primary Cu6Sn5 growing in the bulk liquid prior to tin nucleation. In freestanding balls and joints, SAC305 generally solidifies with a single tin nucleation event and exhibits a mutually-twinned tin grain structure. In contrast, SN100C BGA balls and joints exhibit multiple independent tin grains that grow as a columnar array in joints.

Original languageEnglish
Title of host publicationAdvanced Materials Engineering and Technology IV
EditorsMohd Mustafa Al Bakri Abdullah, Rafiza Abd Razak, Muhammad Faheem Mohd Tahir, Mohd Mustafa Al Bakri Abdullah, Rafiza Abd Razak, Liyana Jamaludin
PublisherTrans Tech Publications Ltd
Pages44-48
Number of pages5
ISBN (Print)9783035710205
DOIs
Publication statusPublished - Jan 1 2016
EventInternational Conference on Advanced Materials Engineering and Technology, ICAMET 2015 - Kaohsiung, Taiwan, Province of China
Duration: Dec 4 2015Dec 5 2015

Publication series

NameMaterials Science Forum
Volume857
ISSN (Print)0255-5476

Other

OtherInternational Conference on Advanced Materials Engineering and Technology, ICAMET 2015
CountryTaiwan, Province of China
CityKaohsiung
Period12/4/1512/5/15

Fingerprint

Tin
solders
Soldering alloys
solidification
Solidification
tin
balls
Nucleation
nucleation
Crystal microstructure
Liquids
Substrates
liquids

All Science Journal Classification (ASJC) codes

  • Materials Science(all)
  • Condensed Matter Physics
  • Mechanics of Materials
  • Mechanical Engineering

Cite this

Gourlay, C. M., Ma, Z. L., Xian, J. W., Belyakov, S. A., Mohd Salleh, M. A. A., Zeng, G., ... Nogita, K. (2016). Solidification of Sn-3Ag-0.5Cu and sn-0.7Cu-0.05Ni solders. In M. M. Al Bakri Abdullah, R. A. Razak, M. F. M. Tahir, M. M. Al Bakri Abdullah, R. A. Razak, & L. Jamaludin (Eds.), Advanced Materials Engineering and Technology IV (pp. 44-48). (Materials Science Forum; Vol. 857). Trans Tech Publications Ltd. https://doi.org/10.4028/www.scientific.net/MSF.857.44

Solidification of Sn-3Ag-0.5Cu and sn-0.7Cu-0.05Ni solders. / Gourlay, C. M.; Ma, Z. L.; Xian, J. W.; Belyakov, S. A.; Mohd Salleh, M. A.A.; Zeng, G.; Yasuda, H.; Nogita, Kazuhiro.

Advanced Materials Engineering and Technology IV. ed. / Mohd Mustafa Al Bakri Abdullah; Rafiza Abd Razak; Muhammad Faheem Mohd Tahir; Mohd Mustafa Al Bakri Abdullah; Rafiza Abd Razak; Liyana Jamaludin. Trans Tech Publications Ltd, 2016. p. 44-48 (Materials Science Forum; Vol. 857).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Gourlay, CM, Ma, ZL, Xian, JW, Belyakov, SA, Mohd Salleh, MAA, Zeng, G, Yasuda, H & Nogita, K 2016, Solidification of Sn-3Ag-0.5Cu and sn-0.7Cu-0.05Ni solders. in MM Al Bakri Abdullah, RA Razak, MFM Tahir, MM Al Bakri Abdullah, RA Razak & L Jamaludin (eds), Advanced Materials Engineering and Technology IV. Materials Science Forum, vol. 857, Trans Tech Publications Ltd, pp. 44-48, International Conference on Advanced Materials Engineering and Technology, ICAMET 2015, Kaohsiung, Taiwan, Province of China, 12/4/15. https://doi.org/10.4028/www.scientific.net/MSF.857.44
Gourlay CM, Ma ZL, Xian JW, Belyakov SA, Mohd Salleh MAA, Zeng G et al. Solidification of Sn-3Ag-0.5Cu and sn-0.7Cu-0.05Ni solders. In Al Bakri Abdullah MM, Razak RA, Tahir MFM, Al Bakri Abdullah MM, Razak RA, Jamaludin L, editors, Advanced Materials Engineering and Technology IV. Trans Tech Publications Ltd. 2016. p. 44-48. (Materials Science Forum). https://doi.org/10.4028/www.scientific.net/MSF.857.44
Gourlay, C. M. ; Ma, Z. L. ; Xian, J. W. ; Belyakov, S. A. ; Mohd Salleh, M. A.A. ; Zeng, G. ; Yasuda, H. ; Nogita, Kazuhiro. / Solidification of Sn-3Ag-0.5Cu and sn-0.7Cu-0.05Ni solders. Advanced Materials Engineering and Technology IV. editor / Mohd Mustafa Al Bakri Abdullah ; Rafiza Abd Razak ; Muhammad Faheem Mohd Tahir ; Mohd Mustafa Al Bakri Abdullah ; Rafiza Abd Razak ; Liyana Jamaludin. Trans Tech Publications Ltd, 2016. pp. 44-48 (Materials Science Forum).
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