Abstract
The solidification of Sn-3Ag-0.5Cu and Sn-0.7Cu-0.05Ni are overviewed and compared. In joints on Cu substrates, both solders begin solidification with primary Cu6Sn5 growing in the bulk liquid prior to tin nucleation. In freestanding balls and joints, SAC305 generally solidifies with a single tin nucleation event and exhibits a mutually-twinned tin grain structure. In contrast, SN100C BGA balls and joints exhibit multiple independent tin grains that grow as a columnar array in joints.
| Original language | English |
|---|---|
| Title of host publication | Advanced Materials Engineering and Technology IV |
| Editors | Mohd Mustafa Al Bakri Abdullah, Rafiza Abd Razak, Muhammad Faheem Mohd Tahir, Mohd Mustafa Al Bakri Abdullah, Rafiza Abd Razak, Liyana Jamaludin |
| Publisher | Trans Tech Publications Ltd |
| Pages | 44-48 |
| Number of pages | 5 |
| ISBN (Print) | 9783035710205 |
| DOIs | |
| Publication status | Published - Jan 1 2016 |
| Event | International Conference on Advanced Materials Engineering and Technology, ICAMET 2015 - Kaohsiung, Taiwan, Province of China Duration: Dec 4 2015 → Dec 5 2015 |
Publication series
| Name | Materials Science Forum |
|---|---|
| Volume | 857 |
| ISSN (Print) | 0255-5476 |
Other
| Other | International Conference on Advanced Materials Engineering and Technology, ICAMET 2015 |
|---|---|
| Country | Taiwan, Province of China |
| City | Kaohsiung |
| Period | 12/4/15 → 12/5/15 |
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All Science Journal Classification (ASJC) codes
- Materials Science(all)
- Condensed Matter Physics
- Mechanics of Materials
- Mechanical Engineering
Cite this
Solidification of Sn-3Ag-0.5Cu and sn-0.7Cu-0.05Ni solders. / Gourlay, C. M.; Ma, Z. L.; Xian, J. W.; Belyakov, S. A.; Mohd Salleh, M. A.A.; Zeng, G.; Yasuda, H.; Nogita, Kazuhiro.
Advanced Materials Engineering and Technology IV. ed. / Mohd Mustafa Al Bakri Abdullah; Rafiza Abd Razak; Muhammad Faheem Mohd Tahir; Mohd Mustafa Al Bakri Abdullah; Rafiza Abd Razak; Liyana Jamaludin. Trans Tech Publications Ltd, 2016. p. 44-48 (Materials Science Forum; Vol. 857).Research output: Chapter in Book/Report/Conference proceeding › Conference contribution
}
TY - GEN
T1 - Solidification of Sn-3Ag-0.5Cu and sn-0.7Cu-0.05Ni solders
AU - Gourlay, C. M.
AU - Ma, Z. L.
AU - Xian, J. W.
AU - Belyakov, S. A.
AU - Mohd Salleh, M. A.A.
AU - Zeng, G.
AU - Yasuda, H.
AU - Nogita, Kazuhiro
PY - 2016/1/1
Y1 - 2016/1/1
N2 - The solidification of Sn-3Ag-0.5Cu and Sn-0.7Cu-0.05Ni are overviewed and compared. In joints on Cu substrates, both solders begin solidification with primary Cu6Sn5 growing in the bulk liquid prior to tin nucleation. In freestanding balls and joints, SAC305 generally solidifies with a single tin nucleation event and exhibits a mutually-twinned tin grain structure. In contrast, SN100C BGA balls and joints exhibit multiple independent tin grains that grow as a columnar array in joints.
AB - The solidification of Sn-3Ag-0.5Cu and Sn-0.7Cu-0.05Ni are overviewed and compared. In joints on Cu substrates, both solders begin solidification with primary Cu6Sn5 growing in the bulk liquid prior to tin nucleation. In freestanding balls and joints, SAC305 generally solidifies with a single tin nucleation event and exhibits a mutually-twinned tin grain structure. In contrast, SN100C BGA balls and joints exhibit multiple independent tin grains that grow as a columnar array in joints.
UR - http://www.scopus.com/inward/record.url?scp=84961266583&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=84961266583&partnerID=8YFLogxK
U2 - 10.4028/www.scientific.net/MSF.857.44
DO - 10.4028/www.scientific.net/MSF.857.44
M3 - Conference contribution
AN - SCOPUS:84961266583
SN - 9783035710205
T3 - Materials Science Forum
SP - 44
EP - 48
BT - Advanced Materials Engineering and Technology IV
A2 - Al Bakri Abdullah, Mohd Mustafa
A2 - Razak, Rafiza Abd
A2 - Tahir, Muhammad Faheem Mohd
A2 - Al Bakri Abdullah, Mohd Mustafa
A2 - Razak, Rafiza Abd
A2 - Jamaludin, Liyana
PB - Trans Tech Publications Ltd
ER -