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Solidification of Sn-3Ag-0.5Cu and sn-0.7Cu-0.05Ni solders
C. M. Gourlay, Z. L. Ma, J. W. Xian, S. A. Belyakov, M. A.A. Mohd Salleh, G. Zeng, H. Yasuda, K. Nogita
Research output: Chapter in Book/Report/Conference proceeding › Conference contribution