Stabilisation of Cu6Sn5 by Ni in Sn-0.7Cu-0.05Ni lead-free solder alloys

Kazuhiro Nogita

Research output: Contribution to journalArticle

122 Citations (Scopus)

Abstract

Cu6Sn5 exists at least in two crystal structures with an allotropic transformation from monoclinic η'-Cu6Sn5 at temperatures lower than 186 °C to hexagonal η-Cu6Sn5. We recently discovered that the hexagonal structure of Cu6Sn5 in lead-free solder alloys with trace Ni additions is stable down to room temperature using high resolution TEM/ED/EDS. This report further confirm the phase stabilising effect of Ni by analysing samples of Cu6Sn5 extracted from a Sn-0.7wt%Cu-0.05wt%Ni lead-free solder alloy. Techniques used include X-ray diffraction, transmission electron microscopy and differential scanning calorimetry.

Original languageEnglish
Pages (from-to)145-149
Number of pages5
JournalIntermetallics
Volume18
Issue number1
DOIs
Publication statusPublished - Jan 1 2010

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Stabilization
Transmission electron microscopy
Energy dispersive spectroscopy
Differential scanning calorimetry
Crystal structure
X ray diffraction
Temperature
Lead-free solders

All Science Journal Classification (ASJC) codes

  • Chemistry(all)
  • Mechanics of Materials
  • Mechanical Engineering
  • Metals and Alloys
  • Materials Chemistry

Cite this

Stabilisation of Cu6Sn5 by Ni in Sn-0.7Cu-0.05Ni lead-free solder alloys. / Nogita, Kazuhiro.

In: Intermetallics, Vol. 18, No. 1, 01.01.2010, p. 145-149.

Research output: Contribution to journalArticle

Nogita, Kazuhiro. / Stabilisation of Cu6Sn5 by Ni in Sn-0.7Cu-0.05Ni lead-free solder alloys. In: Intermetallics. 2010 ; Vol. 18, No. 1. pp. 145-149.
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