Abstract
Cu6Sn5 exists at least in two crystal structures with an allotropic transformation from monoclinic η'-Cu6Sn5 at temperatures lower than 186 °C to hexagonal η-Cu6Sn5. We recently discovered that the hexagonal structure of Cu6Sn5 in lead-free solder alloys with trace Ni additions is stable down to room temperature using high resolution TEM/ED/EDS. This report further confirm the phase stabilising effect of Ni by analysing samples of Cu6Sn5 extracted from a Sn-0.7wt%Cu-0.05wt%Ni lead-free solder alloy. Techniques used include X-ray diffraction, transmission electron microscopy and differential scanning calorimetry.
| Original language | English |
|---|---|
| Pages (from-to) | 145-149 |
| Number of pages | 5 |
| Journal | Intermetallics |
| Volume | 18 |
| Issue number | 1 |
| DOIs | |
| Publication status | Published - Jan 1 2010 |
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All Science Journal Classification (ASJC) codes
- Chemistry(all)
- Mechanics of Materials
- Mechanical Engineering
- Metals and Alloys
- Materials Chemistry
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Stabilisation of Cu6Sn5 by Ni in Sn-0.7Cu-0.05Ni lead-free solder alloys. / Nogita, Kazuhiro.
In: Intermetallics, Vol. 18, No. 1, 01.01.2010, p. 145-149.Research output: Contribution to journal › Article
}
TY - JOUR
T1 - Stabilisation of Cu6Sn5 by Ni in Sn-0.7Cu-0.05Ni lead-free solder alloys
AU - Nogita, Kazuhiro
PY - 2010/1/1
Y1 - 2010/1/1
N2 - Cu6Sn5 exists at least in two crystal structures with an allotropic transformation from monoclinic η'-Cu6Sn5 at temperatures lower than 186 °C to hexagonal η-Cu6Sn5. We recently discovered that the hexagonal structure of Cu6Sn5 in lead-free solder alloys with trace Ni additions is stable down to room temperature using high resolution TEM/ED/EDS. This report further confirm the phase stabilising effect of Ni by analysing samples of Cu6Sn5 extracted from a Sn-0.7wt%Cu-0.05wt%Ni lead-free solder alloy. Techniques used include X-ray diffraction, transmission electron microscopy and differential scanning calorimetry.
AB - Cu6Sn5 exists at least in two crystal structures with an allotropic transformation from monoclinic η'-Cu6Sn5 at temperatures lower than 186 °C to hexagonal η-Cu6Sn5. We recently discovered that the hexagonal structure of Cu6Sn5 in lead-free solder alloys with trace Ni additions is stable down to room temperature using high resolution TEM/ED/EDS. This report further confirm the phase stabilising effect of Ni by analysing samples of Cu6Sn5 extracted from a Sn-0.7wt%Cu-0.05wt%Ni lead-free solder alloy. Techniques used include X-ray diffraction, transmission electron microscopy and differential scanning calorimetry.
UR - http://www.scopus.com/inward/record.url?scp=70349758109&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=70349758109&partnerID=8YFLogxK
U2 - 10.1016/j.intermet.2009.07.005
DO - 10.1016/j.intermet.2009.07.005
M3 - Article
AN - SCOPUS:70349758109
VL - 18
SP - 145
EP - 149
JO - Intermetallics
JF - Intermetallics
SN - 0966-9795
IS - 1
ER -