Stabilisation of Cu6Sn5 by Ni in Sn-0.7Cu-0.05Ni lead-free solder alloys

Kazuhiro Nogita

doi:10.1016/j.intermet.2009.07.005

Stabilisation of Cu₆Sn₅ by Ni in Sn-0.7Cu-0.05Ni lead-free solder alloys

Kazuhiro Nogita

Faculty of Engineering

Research output: Contribution to journal › Article › peer-review

146 Citations (Scopus)

Abstract

Cu₆Sn₅ exists at least in two crystal structures with an allotropic transformation from monoclinic η'-Cu₆Sn₅ at temperatures lower than 186 °C to hexagonal η-Cu₆Sn₅. We recently discovered that the hexagonal structure of Cu₆Sn₅ in lead-free solder alloys with trace Ni additions is stable down to room temperature using high resolution TEM/ED/EDS. This report further confirm the phase stabilising effect of Ni by analysing samples of Cu₆Sn₅ extracted from a Sn-0.7wt%Cu-0.05wt%Ni lead-free solder alloy. Techniques used include X-ray diffraction, transmission electron microscopy and differential scanning calorimetry.

Original language	English
Pages (from-to)	145-149
Number of pages	5
Journal	Intermetallics
Volume	18
Issue number	1
DOIs	https://doi.org/10.1016/j.intermet.2009.07.005
Publication status	Published - Jan 1 2010

All Science Journal Classification (ASJC) codes

Chemistry(all)
Mechanics of Materials
Mechanical Engineering
Metals and Alloys
Materials Chemistry

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10.1016/j.intermet.2009.07.005

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abstract = "Cu6Sn5 exists at least in two crystal structures with an allotropic transformation from monoclinic η'-Cu6Sn5 at temperatures lower than 186 °C to hexagonal η-Cu6Sn5. We recently discovered that the hexagonal structure of Cu6Sn5 in lead-free solder alloys with trace Ni additions is stable down to room temperature using high resolution TEM/ED/EDS. This report further confirm the phase stabilising effect of Ni by analysing samples of Cu6Sn5 extracted from a Sn-0.7wt%Cu-0.05wt%Ni lead-free solder alloy. Techniques used include X-ray diffraction, transmission electron microscopy and differential scanning calorimetry.",

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AB - Cu6Sn5 exists at least in two crystal structures with an allotropic transformation from monoclinic η'-Cu6Sn5 at temperatures lower than 186 °C to hexagonal η-Cu6Sn5. We recently discovered that the hexagonal structure of Cu6Sn5 in lead-free solder alloys with trace Ni additions is stable down to room temperature using high resolution TEM/ED/EDS. This report further confirm the phase stabilising effect of Ni by analysing samples of Cu6Sn5 extracted from a Sn-0.7wt%Cu-0.05wt%Ni lead-free solder alloy. Techniques used include X-ray diffraction, transmission electron microscopy and differential scanning calorimetry.

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