Stabilisation of Cu6Sn5 by Ni in Sn-0.7Cu-0.05Ni lead-free solder alloys

Kazuhiro Nogita

Research output: Contribution to journalArticlepeer-review

154 Citations (Scopus)


Cu6Sn5 exists at least in two crystal structures with an allotropic transformation from monoclinic η'-Cu6Sn5 at temperatures lower than 186 °C to hexagonal η-Cu6Sn5. We recently discovered that the hexagonal structure of Cu6Sn5 in lead-free solder alloys with trace Ni additions is stable down to room temperature using high resolution TEM/ED/EDS. This report further confirm the phase stabilising effect of Ni by analysing samples of Cu6Sn5 extracted from a Sn-0.7wt%Cu-0.05wt%Ni lead-free solder alloy. Techniques used include X-ray diffraction, transmission electron microscopy and differential scanning calorimetry.

Original languageEnglish
Pages (from-to)145-149
Number of pages5
Issue number1
Publication statusPublished - Jan 2010

All Science Journal Classification (ASJC) codes

  • Chemistry(all)
  • Mechanics of Materials
  • Mechanical Engineering
  • Metals and Alloys
  • Materials Chemistry


Dive into the research topics of 'Stabilisation of Cu6Sn5 by Ni in Sn-0.7Cu-0.05Ni lead-free solder alloys'. Together they form a unique fingerprint.

Cite this