Abstract
Cu6Sn5 exists at least in two crystal structures with an allotropic transformation from monoclinic η'-Cu6Sn5 at temperatures lower than 186 °C to hexagonal η-Cu6Sn5. We recently discovered that the hexagonal structure of Cu6Sn5 in lead-free solder alloys with trace Ni additions is stable down to room temperature using high resolution TEM/ED/EDS. This report further confirm the phase stabilising effect of Ni by analysing samples of Cu6Sn5 extracted from a Sn-0.7wt%Cu-0.05wt%Ni lead-free solder alloy. Techniques used include X-ray diffraction, transmission electron microscopy and differential scanning calorimetry.
Original language | English |
---|---|
Pages (from-to) | 145-149 |
Number of pages | 5 |
Journal | Intermetallics |
Volume | 18 |
Issue number | 1 |
DOIs | |
Publication status | Published - Jan 1 2010 |
All Science Journal Classification (ASJC) codes
- Chemistry(all)
- Mechanics of Materials
- Mechanical Engineering
- Metals and Alloys
- Materials Chemistry