Stem analysis of atom location in (Cu, Au, Ni)6Sn5intermetallic compounds

Wen Hui Yang, Tomokazu Yamamoto, Kazuhiro Nogita, Syo Matsumura

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

Cu6Sn5 is an important intermetallic compound in soldering and electronic packaging. It is formed at the interface between molten solder and substrate during the soldering process, and the evolution of microstructure and properties also occurs in service. Previous studies revealed that Au and Ni are stabilization alloying elements for hexagonal η-Cu6Sn5intermetallic. For better understanding of stabilization mechanisms at atomic resolution level, in this work, we made an attempt atomic structure analysis on a stoichiometric (Cu, Au, Ni)6Sn5intermetallic prepared by direct alloying. High-angle annular dark-field (HAADF) imaging and atomic-resolution chemical mapping were taken by the aberration-corrected (Cs-corrected) scanning transmission electron microscopy (STEM). It is found that Au and Ni doped Cu6Sn5has hexagonal structure. The atom sites of Cu1 and Sn can be distinguished in atomic-resolution images after being observed from orientation [2 1 1 0], which is also confirmed by atomic-resolution chemical mapping analysis. Importantly, atomic-resolution about distribution of alloying Au atom was directly observed, and Au atoms occupy the Cu1 sites in η-Cu6Sn5.

Original languageEnglish
Title of host publicationElectronic Packaging Interconnect Technology
EditorsMohd Arif Anuar Mohd Salleh, Mohd Mustafa Al Bakri Abdullah, Muhammad Faheem Mohd Tahir, Liyana Jamaludin, Kazuhiro Nogita
PublisherTrans Tech Publications Ltd
Pages95-100
Number of pages6
ISBN (Print)9783035713244
DOIs
Publication statusPublished - Jan 1 2018
EventElectronic Packaging Interconnect Technology Symposium, EPITS 2017 - Fukuoka, Japan
Duration: Nov 1 2017Nov 2 2017

Publication series

NameSolid State Phenomena
Volume273 SSP
ISSN (Electronic)1662-9779

Other

OtherElectronic Packaging Interconnect Technology Symposium, EPITS 2017
CountryJapan
CityFukuoka
Period11/1/1711/2/17

Fingerprint

stems
Soldering
alloying
Alloying
Atoms
soldering
Stabilization
atoms
Electronics packaging
stabilization
Alloying elements
Image resolution
electronic packaging
Aberrations
Soldering alloys
Intermetallics
Molten materials
image resolution
solders
packaging

All Science Journal Classification (ASJC) codes

  • Atomic and Molecular Physics, and Optics
  • Materials Science(all)
  • Condensed Matter Physics

Cite this

Yang, W. H., Yamamoto, T., Nogita, K., & Matsumura, S. (2018). Stem analysis of atom location in (Cu, Au, Ni)6Sn5intermetallic compounds. In M. A. A. Mohd Salleh, M. M. A. B. Abdullah, M. F. M. Tahir, L. Jamaludin, & K. Nogita (Eds.), Electronic Packaging Interconnect Technology (pp. 95-100). (Solid State Phenomena; Vol. 273 SSP). Trans Tech Publications Ltd. https://doi.org/10.4028/www.scientific.net/SSP.273.95

Stem analysis of atom location in (Cu, Au, Ni)6Sn5intermetallic compounds. / Yang, Wen Hui; Yamamoto, Tomokazu; Nogita, Kazuhiro; Matsumura, Syo.

Electronic Packaging Interconnect Technology. ed. / Mohd Arif Anuar Mohd Salleh; Mohd Mustafa Al Bakri Abdullah; Muhammad Faheem Mohd Tahir; Liyana Jamaludin; Kazuhiro Nogita. Trans Tech Publications Ltd, 2018. p. 95-100 (Solid State Phenomena; Vol. 273 SSP).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Yang, WH, Yamamoto, T, Nogita, K & Matsumura, S 2018, Stem analysis of atom location in (Cu, Au, Ni)6Sn5intermetallic compounds. in MAA Mohd Salleh, MMAB Abdullah, MFM Tahir, L Jamaludin & K Nogita (eds), Electronic Packaging Interconnect Technology. Solid State Phenomena, vol. 273 SSP, Trans Tech Publications Ltd, pp. 95-100, Electronic Packaging Interconnect Technology Symposium, EPITS 2017, Fukuoka, Japan, 11/1/17. https://doi.org/10.4028/www.scientific.net/SSP.273.95
Yang WH, Yamamoto T, Nogita K, Matsumura S. Stem analysis of atom location in (Cu, Au, Ni)6Sn5intermetallic compounds. In Mohd Salleh MAA, Abdullah MMAB, Tahir MFM, Jamaludin L, Nogita K, editors, Electronic Packaging Interconnect Technology. Trans Tech Publications Ltd. 2018. p. 95-100. (Solid State Phenomena). https://doi.org/10.4028/www.scientific.net/SSP.273.95
Yang, Wen Hui ; Yamamoto, Tomokazu ; Nogita, Kazuhiro ; Matsumura, Syo. / Stem analysis of atom location in (Cu, Au, Ni)6Sn5intermetallic compounds. Electronic Packaging Interconnect Technology. editor / Mohd Arif Anuar Mohd Salleh ; Mohd Mustafa Al Bakri Abdullah ; Muhammad Faheem Mohd Tahir ; Liyana Jamaludin ; Kazuhiro Nogita. Trans Tech Publications Ltd, 2018. pp. 95-100 (Solid State Phenomena).
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