Stem analysis of atom location in (Cu, Au, Ni)6Sn5intermetallic compounds

Wen Hui Yang, Tomokazu Yamamoto, Kazuhiro Nogita, Syo Matsumura

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

Cu6Sn5 is an important intermetallic compound in soldering and electronic packaging. It is formed at the interface between molten solder and substrate during the soldering process, and the evolution of microstructure and properties also occurs in service. Previous studies revealed that Au and Ni are stabilization alloying elements for hexagonal η-Cu6Sn5intermetallic. For better understanding of stabilization mechanisms at atomic resolution level, in this work, we made an attempt atomic structure analysis on a stoichiometric (Cu, Au, Ni)6Sn5intermetallic prepared by direct alloying. High-angle annular dark-field (HAADF) imaging and atomic-resolution chemical mapping were taken by the aberration-corrected (Cs-corrected) scanning transmission electron microscopy (STEM). It is found that Au and Ni doped Cu6Sn5has hexagonal structure. The atom sites of Cu1 and Sn can be distinguished in atomic-resolution images after being observed from orientation [2 1 1 0], which is also confirmed by atomic-resolution chemical mapping analysis. Importantly, atomic-resolution about distribution of alloying Au atom was directly observed, and Au atoms occupy the Cu1 sites in η-Cu6Sn5.

Original languageEnglish
Title of host publicationElectronic Packaging Interconnect Technology
EditorsKazuhiro Nogita, Mohd Arif Anuar Mohd Salleh, Mohd Mustafa Al Bakri Abdullah, Muhammad Faheem Mohd Tahir, Liyana Jamaludin
PublisherTrans Tech Publications Ltd
Pages95-100
Number of pages6
ISBN (Print)9783035713244
DOIs
Publication statusPublished - Jan 1 2018
EventElectronic Packaging Interconnect Technology Symposium, EPITS 2017 - Fukuoka, Japan
Duration: Nov 1 2017Nov 2 2017

Publication series

NameSolid State Phenomena
Volume273 SSP
ISSN (Print)1012-0394
ISSN (Electronic)1662-9779

Other

OtherElectronic Packaging Interconnect Technology Symposium, EPITS 2017
CountryJapan
CityFukuoka
Period11/1/1711/2/17

All Science Journal Classification (ASJC) codes

  • Atomic and Molecular Physics, and Optics
  • Materials Science(all)
  • Condensed Matter Physics

Fingerprint Dive into the research topics of 'Stem analysis of atom location in (Cu, Au, Ni)<sub>6</sub>Sn<sub>5</sub>intermetallic compounds'. Together they form a unique fingerprint.

Cite this