Strength reliability of micro polycrystalline silicon structure

Shigeru Hamada, Kenji Hashizume

Research output: Contribution to journalArticle

Abstract

In order to evaluate strength reliability of micron size poly crystalline silicon (poly-Si) structure for microelectromechanical systems (MEMS), bending strength tests of cantilever beam, Weibull analysis of the strength and fracture surface analysis are performed. Recently, the importance of MEMS in society is increasing, and the number of production is also increasing. MEMS devices, which contain mechanical movement, have to maintain their reliability in face of external shock, thermal stress and residual stress from manufacturing processes. When the age of the MEMS mass production comes, in case the material strength design of MEMS is performed, required strength data is not average value but the variation, especially minimum value assumed of the structure and material. Then, in order to evaluate strength reliability of micron size poly-Si structure, tests and analysis are performed. The specimen is made by chemical vapor deposition (CVD) process and the thickness is 3.5, 6.4 and 8.3 [μm] and the specimen has notch (stress concentration). The test specimen used for the test changed characteristics of (1) film thickness (2) stress concentration, and investigation about the influence each effect of the variation in a bending strength with fracture surface analysis are discussed.

Original languageEnglish
Pages (from-to)105-116
Number of pages12
JournalMemoirs of the Faculty of Engineering, Kyushu University
Volume67
Issue number3
Publication statusPublished - Sep 2007
Externally publishedYes

All Science Journal Classification (ASJC) codes

  • Earth and Planetary Sciences(all)
  • Management of Technology and Innovation
  • Atmospheric Science
  • Energy(all)
  • Process Chemistry and Technology

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