Stress analysis of powder compacts with graded structures in sintering process

Kazunari Shinagawa, Yasushi Hirashima

Research output: Chapter in Book/Report/Conference proceedingConference contribution

6 Citations (Scopus)

Abstract

During sintering of metal/ceramic functionally grade materials, cracks are often formed on the surface on the top ceramic layer due to the internal stress produced by mismatch shrinkage and warpage. The ways to reduce the internal stress are examined by using the finite element method as well as the plate theory for sintering. Uniaxial pressing, which gives the counter moment against the warping, can decrease the bending stress but only in the middle of the surface. Thinning the top layer is found to be effective in reducing the tensile stress on the surface when the sintering properties of some layers are modified appropriately. The suppression of the surface cracking in the improved graded powder compacts is confirmed by experiment.

Original languageEnglish
Title of host publicationFunctionally Graded Materials VIII, FGM2004 - Proceedings of the 8th International Symposium on Multifunctional and Functionally Graded Materials, (FGM2004)
Pages477-482
Number of pages6
Publication statusPublished - Dec 1 2005
Externally publishedYes
Event8th International Symposium on Multifunctional and Functionally Graded Materials, FGM2004 - Leuven, Belgium
Duration: Jul 11 2004Jul 14 2004

Publication series

NameMaterials Science Forum
Volume492-493
ISSN (Print)0255-5476

Other

Other8th International Symposium on Multifunctional and Functionally Graded Materials, FGM2004
CountryBelgium
CityLeuven
Period7/11/047/14/04

All Science Journal Classification (ASJC) codes

  • Materials Science(all)
  • Condensed Matter Physics
  • Mechanics of Materials
  • Mechanical Engineering

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  • Cite this

    Shinagawa, K., & Hirashima, Y. (2005). Stress analysis of powder compacts with graded structures in sintering process. In Functionally Graded Materials VIII, FGM2004 - Proceedings of the 8th International Symposium on Multifunctional and Functionally Graded Materials, (FGM2004) (pp. 477-482). (Materials Science Forum; Vol. 492-493).