Stress concentration and surface roughness effect on strength of polycrystalline silicon structure

Shigeru Hamada, Shuichi Tani, Daisuke Katagiri, Masahiro Tsugai, Makio Horikawa, Hiroshi Otani

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

In order to clarify the stress concentration and surface roughness effect on strength of the polycrystalline silicon (poly-Si) structure, bending tests of poly-Si microcantilever beam specimen and surface roughness measurement is performed. The bending test results are analyzed by means of maximum stress at the notch root calculated by FEM models, and it is found that this approach cannot describe the test results. Therefore, modified approach is taken into account by use of two parameters that are the maximum stress and area where stress is larger than 50% of the maximum stress, which indicates stress extension around the position of maximum stress representatively. By this two parameters approach, the test results are explained quantitatively and a strength design chart for stress concentration area of the poly-Si structure is obtained. On the other hand, relationship between strength and surface roughness are confirmed and useful information for the process quality control are obtained.

Original languageEnglish
Title of host publicationProceedings of the ASME/Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems: Advances in Electronic Packaging 2005
Pages1929-1934
Number of pages6
VolumePART C
Publication statusPublished - 2006
Externally publishedYes
EventASME/Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems: Advances in Electronic Packaging 2005 - San Francisco, CA, United States
Duration: Jul 17 2005Jul 22 2005

Other

OtherASME/Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems: Advances in Electronic Packaging 2005
CountryUnited States
CitySan Francisco, CA
Period7/17/057/22/05

Fingerprint

Polysilicon
Stress concentration
Surface roughness
Bending tests
Roughness measurement
Surface measurement
Quality control
Finite element method

All Science Journal Classification (ASJC) codes

  • Engineering(all)

Cite this

Hamada, S., Tani, S., Katagiri, D., Tsugai, M., Horikawa, M., & Otani, H. (2006). Stress concentration and surface roughness effect on strength of polycrystalline silicon structure. In Proceedings of the ASME/Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems: Advances in Electronic Packaging 2005 (Vol. PART C, pp. 1929-1934)

Stress concentration and surface roughness effect on strength of polycrystalline silicon structure. / Hamada, Shigeru; Tani, Shuichi; Katagiri, Daisuke; Tsugai, Masahiro; Horikawa, Makio; Otani, Hiroshi.

Proceedings of the ASME/Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems: Advances in Electronic Packaging 2005. Vol. PART C 2006. p. 1929-1934.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Hamada, S, Tani, S, Katagiri, D, Tsugai, M, Horikawa, M & Otani, H 2006, Stress concentration and surface roughness effect on strength of polycrystalline silicon structure. in Proceedings of the ASME/Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems: Advances in Electronic Packaging 2005. vol. PART C, pp. 1929-1934, ASME/Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems: Advances in Electronic Packaging 2005, San Francisco, CA, United States, 7/17/05.
Hamada S, Tani S, Katagiri D, Tsugai M, Horikawa M, Otani H. Stress concentration and surface roughness effect on strength of polycrystalline silicon structure. In Proceedings of the ASME/Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems: Advances in Electronic Packaging 2005. Vol. PART C. 2006. p. 1929-1934
Hamada, Shigeru ; Tani, Shuichi ; Katagiri, Daisuke ; Tsugai, Masahiro ; Horikawa, Makio ; Otani, Hiroshi. / Stress concentration and surface roughness effect on strength of polycrystalline silicon structure. Proceedings of the ASME/Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems: Advances in Electronic Packaging 2005. Vol. PART C 2006. pp. 1929-1934
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