Structural improvement of nickel metal-induced-lateral-crystallized silicon films using excimer laser annealing

M. Miyasaka, K. Makihira, T. Asano, J. Stoemenos

Research output: Chapter in Book/Report/Conference proceedingConference contribution

1 Citation (Scopus)

Abstract

Crystalline properties of nickel metalinduced- lateral-crystallized (Ni-MILC) silicon films are examined in detail. Laterally grown crystalline grains can be as large as 19 μm, though the grains consist of small misorientated sub-grains. The excimer laser annealing (ELA) method definitely improves Ni-MILC film quality. As a result, fairly good polysilicon thin film transistors are easily fabricated through a low-temperature process. It is, however, difficult to completely eliminate the subgrains by simply applying the ELA method to Ni-MILC silicon films.

Original languageEnglish
Title of host publicationEuropean Solid-State Device Research Conference
EditorsHeiner Ryssel, Gerhard Wachutka, Herbert Grunbacher
PublisherIEEE Computer Society
Pages123-126
Number of pages4
ISBN (Electronic)2914601018
DOIs
Publication statusPublished - Jan 1 2001
Event31st European Solid-State Device Research Conference, ESSDERC 2001 - Nuremberg, Germany
Duration: Sept 11 2001Sept 13 2001

Publication series

NameEuropean Solid-State Device Research Conference
ISSN (Print)1930-8876

Other

Other31st European Solid-State Device Research Conference, ESSDERC 2001
Country/TerritoryGermany
CityNuremberg
Period9/11/019/13/01

All Science Journal Classification (ASJC) codes

  • Electrical and Electronic Engineering
  • Safety, Risk, Reliability and Quality

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