Studies of underfill formulation effects using molecular dynamics and discrete element modeling

N. Iwamoto, M. Li, S. J. McCaffery, M. Nakagawa, G. Mustoe

Research output: Chapter in Book/Report/Conference proceedingConference contribution

1 Citation (Scopus)

Abstract

The underfill phenomenon is driven by many dynamic interactions which can be studied from a fundamental standpoint. Although capillary action generally drives the filling phenomenon, it is the underlying principles that govern the underfill performance properties which must be understood. For instance, flow speed, filler settling, filler striation and voiding are all properties that require mechanistic understanding. Although binder and filler effects are expected from a combination of surface energy and particle dynamics drivers, the simple identification of the problem does not instruct on how to control these effects; and for the formulator or the end-use engineer, such understanding must be reduced to controllable variables. In order to address these issues, both molecular modeling and discrete element modeling have been used to understand the formulation constituent effects.

Original languageEnglish
Title of host publicationProceedings of 3rd International Conference on Adhesive Joining and Coating Technology in Electronics Manufacturing 1998, ADHES 1998
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages321-327
Number of pages7
ISBN (Electronic)0780349342, 9780780349346
DOIs
Publication statusPublished - Jan 1 1998
Externally publishedYes
Event3rd International Conference on Adhesive Joining and Coating Technology in Electronics Manufacturing, ADHES 1998 - Binghamton, United States
Duration: Sep 28 1998Sep 30 1998

Publication series

NameProceedings of 3rd International Conference on Adhesive Joining and Coating Technology in Electronics Manufacturing 1998, ADHES 1998
Volume1998-September

Conference

Conference3rd International Conference on Adhesive Joining and Coating Technology in Electronics Manufacturing, ADHES 1998
CountryUnited States
CityBinghamton
Period9/28/989/30/98

All Science Journal Classification (ASJC) codes

  • Electrical and Electronic Engineering
  • Industrial and Manufacturing Engineering
  • Electronic, Optical and Magnetic Materials
  • Surfaces, Coatings and Films

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  • Cite this

    Iwamoto, N., Li, M., McCaffery, S. J., Nakagawa, M., & Mustoe, G. (1998). Studies of underfill formulation effects using molecular dynamics and discrete element modeling. In Proceedings of 3rd International Conference on Adhesive Joining and Coating Technology in Electronics Manufacturing 1998, ADHES 1998 (pp. 321-327). [742048] (Proceedings of 3rd International Conference on Adhesive Joining and Coating Technology in Electronics Manufacturing 1998, ADHES 1998; Vol. 1998-September). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/ADHES.1998.742048