Studies of underfill formulation effects using molecular dynamics and discrete element modeling

N. Iwamoto, M. Li, S. J. McCaffery, Masami Nakagawa, G. Mustoe

Research output: Chapter in Book/Report/Conference proceedingConference contribution

1 Citation (Scopus)

Abstract

The underfill phenomenon is driven by many dynamic interactions which can be studied from a fundamental standpoint. Although capillary action generally drives the filling phenomenon, it is the underlying principles that govern the underfill performance properties which must be understood. For instance, flow speed, filler settling, filler striation and voiding are all properties that require mechanistic understanding. Although binder and filler effects are expected from a combination of surface energy and particle dynamics drivers, the simple identification of the problem does not instruct on how to control these effects; and for the formulator or the end-use engineer, such understanding must be reduced to controllable variables. In order to address these issues, both molecular modeling and discrete element modeling have been used to understand the formulation constituent effects.

Original languageEnglish
Title of host publicationProceedings of 3rd International Conference on Adhesive Joining and Coating Technology in Electronics Manufacturing 1998, ADHES 1998
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages321-327
Number of pages7
ISBN (Electronic)0780349342, 9780780349346
DOIs
Publication statusPublished - Jan 1 1998
Externally publishedYes
Event3rd International Conference on Adhesive Joining and Coating Technology in Electronics Manufacturing, ADHES 1998 - Binghamton, United States
Duration: Sep 28 1998Sep 30 1998

Publication series

NameProceedings of 3rd International Conference on Adhesive Joining and Coating Technology in Electronics Manufacturing 1998, ADHES 1998
Volume1998-September

Conference

Conference3rd International Conference on Adhesive Joining and Coating Technology in Electronics Manufacturing, ADHES 1998
CountryUnited States
CityBinghamton
Period9/28/989/30/98

Fingerprint

Molecular dynamics
Fillers
Molecular modeling
Interfacial energy
Binders
Engineers

All Science Journal Classification (ASJC) codes

  • Electrical and Electronic Engineering
  • Industrial and Manufacturing Engineering
  • Electronic, Optical and Magnetic Materials
  • Surfaces, Coatings and Films

Cite this

Iwamoto, N., Li, M., McCaffery, S. J., Nakagawa, M., & Mustoe, G. (1998). Studies of underfill formulation effects using molecular dynamics and discrete element modeling. In Proceedings of 3rd International Conference on Adhesive Joining and Coating Technology in Electronics Manufacturing 1998, ADHES 1998 (pp. 321-327). [742048] (Proceedings of 3rd International Conference on Adhesive Joining and Coating Technology in Electronics Manufacturing 1998, ADHES 1998; Vol. 1998-September). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/ADHES.1998.742048

Studies of underfill formulation effects using molecular dynamics and discrete element modeling. / Iwamoto, N.; Li, M.; McCaffery, S. J.; Nakagawa, Masami; Mustoe, G.

Proceedings of 3rd International Conference on Adhesive Joining and Coating Technology in Electronics Manufacturing 1998, ADHES 1998. Institute of Electrical and Electronics Engineers Inc., 1998. p. 321-327 742048 (Proceedings of 3rd International Conference on Adhesive Joining and Coating Technology in Electronics Manufacturing 1998, ADHES 1998; Vol. 1998-September).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Iwamoto, N, Li, M, McCaffery, SJ, Nakagawa, M & Mustoe, G 1998, Studies of underfill formulation effects using molecular dynamics and discrete element modeling. in Proceedings of 3rd International Conference on Adhesive Joining and Coating Technology in Electronics Manufacturing 1998, ADHES 1998., 742048, Proceedings of 3rd International Conference on Adhesive Joining and Coating Technology in Electronics Manufacturing 1998, ADHES 1998, vol. 1998-September, Institute of Electrical and Electronics Engineers Inc., pp. 321-327, 3rd International Conference on Adhesive Joining and Coating Technology in Electronics Manufacturing, ADHES 1998, Binghamton, United States, 9/28/98. https://doi.org/10.1109/ADHES.1998.742048
Iwamoto N, Li M, McCaffery SJ, Nakagawa M, Mustoe G. Studies of underfill formulation effects using molecular dynamics and discrete element modeling. In Proceedings of 3rd International Conference on Adhesive Joining and Coating Technology in Electronics Manufacturing 1998, ADHES 1998. Institute of Electrical and Electronics Engineers Inc. 1998. p. 321-327. 742048. (Proceedings of 3rd International Conference on Adhesive Joining and Coating Technology in Electronics Manufacturing 1998, ADHES 1998). https://doi.org/10.1109/ADHES.1998.742048
Iwamoto, N. ; Li, M. ; McCaffery, S. J. ; Nakagawa, Masami ; Mustoe, G. / Studies of underfill formulation effects using molecular dynamics and discrete element modeling. Proceedings of 3rd International Conference on Adhesive Joining and Coating Technology in Electronics Manufacturing 1998, ADHES 1998. Institute of Electrical and Electronics Engineers Inc., 1998. pp. 321-327 (Proceedings of 3rd International Conference on Adhesive Joining and Coating Technology in Electronics Manufacturing 1998, ADHES 1998).
@inproceedings{1872c8571797421cb4e9e6dd53fe1372,
title = "Studies of underfill formulation effects using molecular dynamics and discrete element modeling",
abstract = "The underfill phenomenon is driven by many dynamic interactions which can be studied from a fundamental standpoint. Although capillary action generally drives the filling phenomenon, it is the underlying principles that govern the underfill performance properties which must be understood. For instance, flow speed, filler settling, filler striation and voiding are all properties that require mechanistic understanding. Although binder and filler effects are expected from a combination of surface energy and particle dynamics drivers, the simple identification of the problem does not instruct on how to control these effects; and for the formulator or the end-use engineer, such understanding must be reduced to controllable variables. In order to address these issues, both molecular modeling and discrete element modeling have been used to understand the formulation constituent effects.",
author = "N. Iwamoto and M. Li and McCaffery, {S. J.} and Masami Nakagawa and G. Mustoe",
year = "1998",
month = "1",
day = "1",
doi = "10.1109/ADHES.1998.742048",
language = "English",
series = "Proceedings of 3rd International Conference on Adhesive Joining and Coating Technology in Electronics Manufacturing 1998, ADHES 1998",
publisher = "Institute of Electrical and Electronics Engineers Inc.",
pages = "321--327",
booktitle = "Proceedings of 3rd International Conference on Adhesive Joining and Coating Technology in Electronics Manufacturing 1998, ADHES 1998",
address = "United States",

}

TY - GEN

T1 - Studies of underfill formulation effects using molecular dynamics and discrete element modeling

AU - Iwamoto, N.

AU - Li, M.

AU - McCaffery, S. J.

AU - Nakagawa, Masami

AU - Mustoe, G.

PY - 1998/1/1

Y1 - 1998/1/1

N2 - The underfill phenomenon is driven by many dynamic interactions which can be studied from a fundamental standpoint. Although capillary action generally drives the filling phenomenon, it is the underlying principles that govern the underfill performance properties which must be understood. For instance, flow speed, filler settling, filler striation and voiding are all properties that require mechanistic understanding. Although binder and filler effects are expected from a combination of surface energy and particle dynamics drivers, the simple identification of the problem does not instruct on how to control these effects; and for the formulator or the end-use engineer, such understanding must be reduced to controllable variables. In order to address these issues, both molecular modeling and discrete element modeling have been used to understand the formulation constituent effects.

AB - The underfill phenomenon is driven by many dynamic interactions which can be studied from a fundamental standpoint. Although capillary action generally drives the filling phenomenon, it is the underlying principles that govern the underfill performance properties which must be understood. For instance, flow speed, filler settling, filler striation and voiding are all properties that require mechanistic understanding. Although binder and filler effects are expected from a combination of surface energy and particle dynamics drivers, the simple identification of the problem does not instruct on how to control these effects; and for the formulator or the end-use engineer, such understanding must be reduced to controllable variables. In order to address these issues, both molecular modeling and discrete element modeling have been used to understand the formulation constituent effects.

UR - http://www.scopus.com/inward/record.url?scp=84889149963&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=84889149963&partnerID=8YFLogxK

U2 - 10.1109/ADHES.1998.742048

DO - 10.1109/ADHES.1998.742048

M3 - Conference contribution

AN - SCOPUS:84889149963

T3 - Proceedings of 3rd International Conference on Adhesive Joining and Coating Technology in Electronics Manufacturing 1998, ADHES 1998

SP - 321

EP - 327

BT - Proceedings of 3rd International Conference on Adhesive Joining and Coating Technology in Electronics Manufacturing 1998, ADHES 1998

PB - Institute of Electrical and Electronics Engineers Inc.

ER -