Study of SiO 2 thickness effect on insertion loss of CMOS 60 GHz band pass filter

Nessim Mahmoud, Adel Barakat, Anwer S.Abd El-Hameed, Adel B. Abdel-Rahman, Ahmed Allam, Ramesh Pokharel

Research output: Chapter in Book/Report/Conference proceedingConference contribution

1 Citation (Scopus)

Abstract

This paper presents a study of the effect of the SiO 2 substrate thickness on the insertion loss performance of half wavelength open loop resonator bandpass filter. It has been observed that the main reason for insertion loss degradation is the small thickness of SiO 2 . An insertion loss of -1.49dB is achieved with a SiO 2 thickness of 24μm. Furthermore, an equivalent lumped circuit model of the filter is proposed to verify this observation. The S-parameters of lumped element circuit model are obtained using the ADS simulator and compared with the results obtained from the EM simulator showing good agreement.

Original languageEnglish
Title of host publication2015 IEEE International Conference on Electronics, Circuits, and Systems, ICECS 2015
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages237-239
Number of pages3
ISBN (Electronic)9781509002467
DOIs
Publication statusPublished - Mar 23 2016
EventIEEE International Conference on Electronics, Circuits, and Systems, ICECS 2015 - Cairo, Egypt
Duration: Dec 6 2015Dec 9 2015

Publication series

NameProceedings of the IEEE International Conference on Electronics, Circuits, and Systems
Volume2016-March

Other

OtherIEEE International Conference on Electronics, Circuits, and Systems, ICECS 2015
CountryEgypt
CityCairo
Period12/6/1512/9/15

All Science Journal Classification (ASJC) codes

  • Electrical and Electronic Engineering

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    Mahmoud, N., Barakat, A., El-Hameed, A. S. A., Abdel-Rahman, A. B., Allam, A., & Pokharel, R. (2016). Study of SiO 2 thickness effect on insertion loss of CMOS 60 GHz band pass filter In 2015 IEEE International Conference on Electronics, Circuits, and Systems, ICECS 2015 (pp. 237-239). [7440292] (Proceedings of the IEEE International Conference on Electronics, Circuits, and Systems; Vol. 2016-March). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/ICECS.2015.7440292