Study on a novel CMP/P-CVM fusion processing system (Type B) and its basic characteristics

Koki Oyama; Yasuhisa Sano; Hideo Aida; Seongwoo Kim; Hideakli Nishizawa; Toshiro K. Doi; Syuhei Kurokawa; Tadakazu Miyashita; Tsutomu Yamazaki

doi:10.1109/ICPT.2014.7017266

Study on a novel CMP/P-CVM fusion processing system (Type B) and its basic characteristics

Koki Oyama, Yasuhisa Sano, Hideo Aida, Seongwoo Kim, Hideakli Nishizawa, Toshiro K. Doi, Syuhei Kurokawa, Tadakazu Miyashita, Tsutomu Yamazaki

Manufacturing Process

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

1 Citation (Scopus)

Abstract

In this study, we are aiming to establish a high-efficiency, high-quality polishing process of the hard-to-process materials. Recently high-grade semiconductor substrates are made by various processing methods. CMP (Chemical Mechanical Polishing) is a main processing method to planarize a substrate. On the other hand, P-CVM is a superior processing method which does not damage the substrate surface. To achieve high-efficiency, high-quality processing, we designed an innovative fusion CMP/P-CVM processing machine and produced it experimentally. Through investigation of a fundamental property of the CMP/P-CVM fusion processing machine, we confirmed increase in removal rate and reduction of the surface roughness by the synergistic effects.

Original language	English
Title of host publication	ICPT 2014 - Proceedings of International Conference on Planarization/CMP Technology 2014
Publisher	Institute of Electrical and Electronics Engineers Inc.
Pages	142-146
Number of pages	5
ISBN (Electronic)	9781479955565
DOIs	https://doi.org/10.1109/ICPT.2014.7017266
Publication status	Published - Jan 20 2015
Event	11th International Conference on Planarization/CMP Technology, ICPT 2014 - Kobe, Japan Duration: Nov 19 2014 → Nov 21 2014

Publication series

Name	ICPT 2014 - Proceedings of International Conference on Planarization/CMP Technology 2014

Other

Other	11th International Conference on Planarization/CMP Technology, ICPT 2014
Country/Territory	Japan
City	Kobe
Period	11/19/14 → 11/21/14

All Science Journal Classification (ASJC) codes

Electrical and Electronic Engineering
Hardware and Architecture

Access to Document

10.1109/ICPT.2014.7017266

Cite this

Oyama, K., Sano, Y., Aida, H., Kim, S., Nishizawa, H., Doi, T. K., Kurokawa, S., Miyashita, T., & Yamazaki, T. (2015). Study on a novel CMP/P-CVM fusion processing system (Type B) and its basic characteristics. In ICPT 2014 - Proceedings of International Conference on Planarization/CMP Technology 2014 (pp. 142-146). [7017266] (ICPT 2014 - Proceedings of International Conference on Planarization/CMP Technology 2014). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/ICPT.2014.7017266

Study on a novel CMP/P-CVM fusion processing system (Type B) and its basic characteristics. / Oyama, Koki; Sano, Yasuhisa; Aida, Hideo et al.
ICPT 2014 - Proceedings of International Conference on Planarization/CMP Technology 2014. Institute of Electrical and Electronics Engineers Inc., 2015. p. 142-146 7017266 (ICPT 2014 - Proceedings of International Conference on Planarization/CMP Technology 2014).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Oyama, K, Sano, Y, Aida, H, Kim, S, Nishizawa, H, Doi, TK, Kurokawa, S, Miyashita, T & Yamazaki, T 2015, Study on a novel CMP/P-CVM fusion processing system (Type B) and its basic characteristics. in ICPT 2014 - Proceedings of International Conference on Planarization/CMP Technology 2014., 7017266, ICPT 2014 - Proceedings of International Conference on Planarization/CMP Technology 2014, Institute of Electrical and Electronics Engineers Inc., pp. 142-146, 11th International Conference on Planarization/CMP Technology, ICPT 2014, Kobe, Japan, 11/19/14. https://doi.org/10.1109/ICPT.2014.7017266

Oyama K, Sano Y, Aida H, Kim S, Nishizawa H, Doi TK et al. Study on a novel CMP/P-CVM fusion processing system (Type B) and its basic characteristics. In ICPT 2014 - Proceedings of International Conference on Planarization/CMP Technology 2014. Institute of Electrical and Electronics Engineers Inc. 2015. p. 142-146. 7017266. (ICPT 2014 - Proceedings of International Conference on Planarization/CMP Technology 2014). doi: 10.1109/ICPT.2014.7017266

Oyama, Koki ; Sano, Yasuhisa ; Aida, Hideo et al. / Study on a novel CMP/P-CVM fusion processing system (Type B) and its basic characteristics. ICPT 2014 - Proceedings of International Conference on Planarization/CMP Technology 2014. Institute of Electrical and Electronics Engineers Inc., 2015. pp. 142-146 (ICPT 2014 - Proceedings of International Conference on Planarization/CMP Technology 2014).

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AU - Doi, Toshiro K.

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Study on a novel CMP/P-CVM fusion processing system (Type B) and its basic characteristics

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