Study on a novel CMP/P-CVM fusion processing system (Type B) and its basic characteristics

Koki Oyama, Yasuhisa Sano, Hideo Aida, Seongwoo Kim, Hideakli Nishizawa, Toshiro K. Doi, Syuhei Kurokawa, Tadakazu Miyashita, Tsutomu Yamazaki

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

In this study, we are aiming to establish a high-efficiency, high-quality polishing process of the hard-to-process materials. Recently high-grade semiconductor substrates are made by various processing methods. CMP (Chemical Mechanical Polishing) is a main processing method to planarize a substrate. On the other hand, P-CVM is a superior processing method which does not damage the substrate surface. To achieve high-efficiency, high-quality processing, we designed an innovative fusion CMP/P-CVM processing machine and produced it experimentally. Through investigation of a fundamental property of the CMP/P-CVM fusion processing machine, we confirmed increase in removal rate and reduction of the surface roughness by the synergistic effects.

Original languageEnglish
Title of host publicationICPT 2014 - Proceedings of International Conference on Planarization/CMP Technology 2014
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages142-146
Number of pages5
ISBN (Electronic)9781479955565
DOIs
Publication statusPublished - Jan 20 2015
Event11th International Conference on Planarization/CMP Technology, ICPT 2014 - Kobe, Japan
Duration: Nov 19 2014Nov 21 2014

Publication series

NameICPT 2014 - Proceedings of International Conference on Planarization/CMP Technology 2014

Other

Other11th International Conference on Planarization/CMP Technology, ICPT 2014
CountryJapan
CityKobe
Period11/19/1411/21/14

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All Science Journal Classification (ASJC) codes

  • Electrical and Electronic Engineering
  • Hardware and Architecture

Cite this

Oyama, K., Sano, Y., Aida, H., Kim, S., Nishizawa, H., Doi, T. K., ... Yamazaki, T. (2015). Study on a novel CMP/P-CVM fusion processing system (Type B) and its basic characteristics. In ICPT 2014 - Proceedings of International Conference on Planarization/CMP Technology 2014 (pp. 142-146). [7017266] (ICPT 2014 - Proceedings of International Conference on Planarization/CMP Technology 2014). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/ICPT.2014.7017266