Study on factors in time-dependent dielectric breakdown degradation of Cu/low-k integration related to Cu chemical-mechanical polishing

Yohei Yamada, Nobuhiro Konishi, Junji Noguchi, Tomoko Jimbo, Syuhei Kurokawa, Toshiro Doi

Research output: Contribution to journalArticlepeer-review

6 Citations (Scopus)

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Physics & Astronomy

Engineering & Materials Science