Study on heat transfer from small heating elements in an integrated circuit chip

Kunio Hijikata, Takao Nagasaki, Ryo Kurazume, Wataru Nakayama

Research output: Chapter in Book/Report/Conference proceedingConference contribution

4 Citations (Scopus)

Abstract

Heat transfer from small heating elements on a substrate was studied experimentally and analytically. In one of the experiments, the heating elements are diodes, each having the size 20μm×20μm, and the substrate is a real IC chip. In another set of experiments, the heaters are narrow strips of In2O3, each being 20μm×20μm, deposited on a glass plate. In both sets of the experiments the heaters are activated singly or simultaneously, and cooled by forced convection of air, in either impinging jet or channel flow. The analytical interpretation of the experimental data indicates that heat conduction from the heat source to the substrate is an important factor in the determination of the maximum temperature at the source, while the surface heat transfer determines the bulk temperature of the substrate. The superposition of the temperature solutions is a vital method to estimate the temperature field in the presence of multiple heat sources in close proximity to each other.

Original languageEnglish
Title of host publicationASME/JSME Thermal Engineering Joint Conference
PublisherPubl by ASME
Pages93-98
Number of pages6
ISBN (Print)0791806154
Publication statusPublished - 1991
Externally publishedYes
EventProceedings of the 3rd ASME/JSME Thermal Engineering Joint Conference Part 4 (of 5)OA - Reno, NV, USA
Duration: Mar 17 1991Mar 22 1991

Other

OtherProceedings of the 3rd ASME/JSME Thermal Engineering Joint Conference Part 4 (of 5)OA
CityReno, NV, USA
Period3/17/913/22/91

Fingerprint

Electric heating elements
Integrated circuits
Heat transfer
Substrates
Experiments
Forced convection
Channel flow
Heat conduction
Temperature
Diodes
Temperature distribution
Glass
Air
Hot Temperature

All Science Journal Classification (ASJC) codes

  • Engineering(all)

Cite this

Hijikata, K., Nagasaki, T., Kurazume, R., & Nakayama, W. (1991). Study on heat transfer from small heating elements in an integrated circuit chip. In ASME/JSME Thermal Engineering Joint Conference (pp. 93-98). Publ by ASME.

Study on heat transfer from small heating elements in an integrated circuit chip. / Hijikata, Kunio; Nagasaki, Takao; Kurazume, Ryo; Nakayama, Wataru.

ASME/JSME Thermal Engineering Joint Conference. Publ by ASME, 1991. p. 93-98.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Hijikata, K, Nagasaki, T, Kurazume, R & Nakayama, W 1991, Study on heat transfer from small heating elements in an integrated circuit chip. in ASME/JSME Thermal Engineering Joint Conference. Publ by ASME, pp. 93-98, Proceedings of the 3rd ASME/JSME Thermal Engineering Joint Conference Part 4 (of 5)OA, Reno, NV, USA, 3/17/91.
Hijikata K, Nagasaki T, Kurazume R, Nakayama W. Study on heat transfer from small heating elements in an integrated circuit chip. In ASME/JSME Thermal Engineering Joint Conference. Publ by ASME. 1991. p. 93-98
Hijikata, Kunio ; Nagasaki, Takao ; Kurazume, Ryo ; Nakayama, Wataru. / Study on heat transfer from small heating elements in an integrated circuit chip. ASME/JSME Thermal Engineering Joint Conference. Publ by ASME, 1991. pp. 93-98
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