Study on innovative plasma fusion CMP and its application to processing of diamond substrate

Hideaki Nishizawa, Koki Oyama, Toshiro K. Doi, Hideo Aida, Seongwoo Kim, Yasuhisa Sano, Syuhei Kurokawa, Chengwu Wan

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

An innovative planarization system named plasma fusion CMP was developed for aiming to establish a high-efficiency/high-quality polishing process of the hard-to-process materials. In this study, we applied this system to processing of diamond substrate instead of conventional CMP (Chemical Mechanical Polishing) process. We confirmed that stable atmospheric plasma was generated in our dynamic system, and the system worked well even though CMP slurry was applied into the system. In the processing experiments of diamond substrate, plasma fusion CMP achieved 667.7 nm/hr of processing rate while conventional CMP resulted in only 1.9 nm/hr. Furthermore, plasma fusion CMP showed the superior surface roughness reduction of the substrate to CMP.

Original languageEnglish
Title of host publication2015 International Conference on Planarization/CMP Technology, ICPT 2015
PublisherInstitute of Electrical and Electronics Engineers Inc.
ISBN (Electronic)9781619565104
Publication statusPublished - Feb 17 2016
EventInternational Conference on Planarization/CMP Technology, ICPT 2015 - Chandler, United States
Duration: Sep 30 2015Oct 2 2015

Publication series

Name2015 International Conference on Planarization/CMP Technology, ICPT 2015

Other

OtherInternational Conference on Planarization/CMP Technology, ICPT 2015
CountryUnited States
CityChandler
Period9/30/1510/2/15

Fingerprint

Diamond
Chemical mechanical polishing
Diamonds
Fusion reactions
Plasmas
Substrates
Processing
Polishing
Dynamical systems
Surface roughness

All Science Journal Classification (ASJC) codes

  • Process Chemistry and Technology
  • Electronic, Optical and Magnetic Materials

Cite this

Nishizawa, H., Oyama, K., Doi, T. K., Aida, H., Kim, S., Sano, Y., ... Wan, C. (2016). Study on innovative plasma fusion CMP and its application to processing of diamond substrate. In 2015 International Conference on Planarization/CMP Technology, ICPT 2015 [7412031] (2015 International Conference on Planarization/CMP Technology, ICPT 2015). Institute of Electrical and Electronics Engineers Inc..

Study on innovative plasma fusion CMP and its application to processing of diamond substrate. / Nishizawa, Hideaki; Oyama, Koki; Doi, Toshiro K.; Aida, Hideo; Kim, Seongwoo; Sano, Yasuhisa; Kurokawa, Syuhei; Wan, Chengwu.

2015 International Conference on Planarization/CMP Technology, ICPT 2015. Institute of Electrical and Electronics Engineers Inc., 2016. 7412031 (2015 International Conference on Planarization/CMP Technology, ICPT 2015).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Nishizawa, H, Oyama, K, Doi, TK, Aida, H, Kim, S, Sano, Y, Kurokawa, S & Wan, C 2016, Study on innovative plasma fusion CMP and its application to processing of diamond substrate. in 2015 International Conference on Planarization/CMP Technology, ICPT 2015., 7412031, 2015 International Conference on Planarization/CMP Technology, ICPT 2015, Institute of Electrical and Electronics Engineers Inc., International Conference on Planarization/CMP Technology, ICPT 2015, Chandler, United States, 9/30/15.
Nishizawa H, Oyama K, Doi TK, Aida H, Kim S, Sano Y et al. Study on innovative plasma fusion CMP and its application to processing of diamond substrate. In 2015 International Conference on Planarization/CMP Technology, ICPT 2015. Institute of Electrical and Electronics Engineers Inc. 2016. 7412031. (2015 International Conference on Planarization/CMP Technology, ICPT 2015).
Nishizawa, Hideaki ; Oyama, Koki ; Doi, Toshiro K. ; Aida, Hideo ; Kim, Seongwoo ; Sano, Yasuhisa ; Kurokawa, Syuhei ; Wan, Chengwu. / Study on innovative plasma fusion CMP and its application to processing of diamond substrate. 2015 International Conference on Planarization/CMP Technology, ICPT 2015. Institute of Electrical and Electronics Engineers Inc., 2016. (2015 International Conference on Planarization/CMP Technology, ICPT 2015).
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