Sub-wavelength micromachining of silica glass by irradiation of CO 2 laser with Fresnel diffraction

K. Okazaki, S. Torii, T. Makimura, H. Niino, K. Murakami, Daisuke Nakamura, Akihiko Takahashi, T. Okada

Research output: Contribution to journalArticle

1 Citation (Scopus)

Abstract

We investigated a simple and productive micromachining method of silica glass by ablation using a TEA CO2 laser (10.6 μm) with a spatial resolution down to subwavelength scale. The silica glass was irradiated by the TEA CO2 laser light through a copper grid mask with square apertures of 20×20 μm2 attached to the silica glass surface. After the irradiation, circular holes with a diameter of several μm were formed on the silica glass surface at the centers of the apertures due to the Fresnel diffraction effect. The minimum diameter of the holes was 3.4 μm. The characteristics of the micromachining are discussed based on the electric field distributions of the CO2 laser light under the mask using a three-dimensional full-wave electromagnetic field simulation.

Original languageEnglish
Pages (from-to)593-599
Number of pages7
JournalApplied Physics A: Materials Science and Processing
Volume104
Issue number2
DOIs
Publication statusPublished - Aug 1 2011

Fingerprint

Fresnel diffraction
Micromachining
silica glass
Carbon Monoxide
Fused silica
micromachining
Diffraction
Irradiation
Wavelength
TEA lasers
irradiation
Lasers
wavelengths
lasers
Masks
masks
apertures
Ablation
Electromagnetic fields
ablation

All Science Journal Classification (ASJC) codes

  • Chemistry(all)
  • Materials Science(all)

Cite this

Sub-wavelength micromachining of silica glass by irradiation of CO 2 laser with Fresnel diffraction. / Okazaki, K.; Torii, S.; Makimura, T.; Niino, H.; Murakami, K.; Nakamura, Daisuke; Takahashi, Akihiko; Okada, T.

In: Applied Physics A: Materials Science and Processing, Vol. 104, No. 2, 01.08.2011, p. 593-599.

Research output: Contribution to journalArticle

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