Sub-wavelength micromachining of silica glass by irradiation of infrared laser with Fresnel diffraction

K. Okazaki; D. Nakamura; T. Okada; H. Niino; S. Torii; T. Makimura; K. Murakami; A. Takahashi

doi:10.1109/TENCON.2010.5686422

Sub-wavelength micromachining of silica glass by irradiation of infrared laser with Fresnel diffraction

K. Okazaki, D. Nakamura, T. Okada, H. Niino, S. Torii, T. Makimura, K. Murakami, A. Takahashi

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Abstract

We investigated a simple and productive micromachining method of silica glass by the ablation using a 10.6 μm TEA CO₂ laser with a spatial resolution down to sub-wavelength scale. Copper grid mask with square apertures of 20×20 μm was attached to the silica glass surface, and the silica glass was irradiated by the TEA CO₂ laser light through the mask. As a result, circular holes were formed on the silica glass surface at the center of the apertures due to the Fresnel diffraction effect, and a minimum diameter of the hole was less than 3 μm. The mechanism of the micromachining was discussed based on the electric field distribution of the CO₂ laser light under the mask, by a 3D full-wave electromagnetic field simulation.

Original language	English
Title of host publication	TENCON 2010 - 2010 IEEE Region 10 Conference
Pages	1905-1908
Number of pages	4
DOIs	https://doi.org/10.1109/TENCON.2010.5686422
Publication status	Published - Dec 1 2010
Event	2010 IEEE Region 10 Conference, TENCON 2010 - Fukuoka, Japan Duration: Nov 21 2010 → Nov 24 2010

Publication series

Name	IEEE Region 10 Annual International Conference, Proceedings/TENCON

Other

Other	2010 IEEE Region 10 Conference, TENCON 2010
Country/Territory	Japan
City	Fukuoka
Period	11/21/10 → 11/24/10

All Science Journal Classification (ASJC) codes

Computer Science Applications
Electrical and Electronic Engineering

Access to Document

10.1109/TENCON.2010.5686422

Cite this

Okazaki, K., Nakamura, D., Okada, T., Niino, H., Torii, S., Makimura, T., Murakami, K., & Takahashi, A. (2010). Sub-wavelength micromachining of silica glass by irradiation of infrared laser with Fresnel diffraction. In TENCON 2010 - 2010 IEEE Region 10 Conference (pp. 1905-1908). [5686422] (IEEE Region 10 Annual International Conference, Proceedings/TENCON). https://doi.org/10.1109/TENCON.2010.5686422

Sub-wavelength micromachining of silica glass by irradiation of infrared laser with Fresnel diffraction. / Okazaki, K.; Nakamura, D.; Okada, T. et al.

TENCON 2010 - 2010 IEEE Region 10 Conference. 2010. p. 1905-1908 5686422 (IEEE Region 10 Annual International Conference, Proceedings/TENCON).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Okazaki, K, Nakamura, D, Okada, T, Niino, H, Torii, S, Makimura, T, Murakami, K & Takahashi, A 2010, Sub-wavelength micromachining of silica glass by irradiation of infrared laser with Fresnel diffraction. in TENCON 2010 - 2010 IEEE Region 10 Conference., 5686422, IEEE Region 10 Annual International Conference, Proceedings/TENCON, pp. 1905-1908, 2010 IEEE Region 10 Conference, TENCON 2010, Fukuoka, Japan, 11/21/10. https://doi.org/10.1109/TENCON.2010.5686422

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title = "Sub-wavelength micromachining of silica glass by irradiation of infrared laser with Fresnel diffraction",

abstract = "We investigated a simple and productive micromachining method of silica glass by the ablation using a 10.6 μm TEA CO2 laser with a spatial resolution down to sub-wavelength scale. Copper grid mask with square apertures of 20×20 μm was attached to the silica glass surface, and the silica glass was irradiated by the TEA CO2 laser light through the mask. As a result, circular holes were formed on the silica glass surface at the center of the apertures due to the Fresnel diffraction effect, and a minimum diameter of the hole was less than 3 μm. The mechanism of the micromachining was discussed based on the electric field distribution of the CO2 laser light under the mask, by a 3D full-wave electromagnetic field simulation.",

author = "K. Okazaki and D. Nakamura and T. Okada and H. Niino and S. Torii and T. Makimura and K. Murakami and A. Takahashi",

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AU - Okazaki, K.

AU - Nakamura, D.

AU - Okada, T.

AU - Niino, H.

AU - Torii, S.

AU - Makimura, T.

AU - Murakami, K.

AU - Takahashi, A.

PY - 2010/12/1

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N2 - We investigated a simple and productive micromachining method of silica glass by the ablation using a 10.6 μm TEA CO2 laser with a spatial resolution down to sub-wavelength scale. Copper grid mask with square apertures of 20×20 μm was attached to the silica glass surface, and the silica glass was irradiated by the TEA CO2 laser light through the mask. As a result, circular holes were formed on the silica glass surface at the center of the apertures due to the Fresnel diffraction effect, and a minimum diameter of the hole was less than 3 μm. The mechanism of the micromachining was discussed based on the electric field distribution of the CO2 laser light under the mask, by a 3D full-wave electromagnetic field simulation.

AB - We investigated a simple and productive micromachining method of silica glass by the ablation using a 10.6 μm TEA CO2 laser with a spatial resolution down to sub-wavelength scale. Copper grid mask with square apertures of 20×20 μm was attached to the silica glass surface, and the silica glass was irradiated by the TEA CO2 laser light through the mask. As a result, circular holes were formed on the silica glass surface at the center of the apertures due to the Fresnel diffraction effect, and a minimum diameter of the hole was less than 3 μm. The mechanism of the micromachining was discussed based on the electric field distribution of the CO2 laser light under the mask, by a 3D full-wave electromagnetic field simulation.

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Sub-wavelength micromachining of silica glass by irradiation of infrared laser with Fresnel diffraction

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