Sub-wavelength micromachining of silica glass by irradiation of infrared laser with Fresnel diffraction

K. Okazaki, Daisuke Nakamura, T. Okada, H. Niino, S. Torii, T. Makimura, K. Murakami, Akihiko Takahashi

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

We investigated a simple and productive micromachining method of silica glass by the ablation using a 10.6 μm TEA CO2 laser with a spatial resolution down to sub-wavelength scale. Copper grid mask with square apertures of 20×20 μm was attached to the silica glass surface, and the silica glass was irradiated by the TEA CO2 laser light through the mask. As a result, circular holes were formed on the silica glass surface at the center of the apertures due to the Fresnel diffraction effect, and a minimum diameter of the hole was less than 3 μm. The mechanism of the micromachining was discussed based on the electric field distribution of the CO2 laser light under the mask, by a 3D full-wave electromagnetic field simulation.

Original languageEnglish
Title of host publicationTENCON 2010 - 2010 IEEE Region 10 Conference
Pages1905-1908
Number of pages4
DOIs
Publication statusPublished - 2010
Event2010 IEEE Region 10 Conference, TENCON 2010 - Fukuoka, Japan
Duration: Nov 21 2010Nov 24 2010

Other

Other2010 IEEE Region 10 Conference, TENCON 2010
CountryJapan
CityFukuoka
Period11/21/1011/24/10

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All Science Journal Classification (ASJC) codes

  • Electrical and Electronic Engineering
  • Computer Science Applications

Cite this

Okazaki, K., Nakamura, D., Okada, T., Niino, H., Torii, S., Makimura, T., ... Takahashi, A. (2010). Sub-wavelength micromachining of silica glass by irradiation of infrared laser with Fresnel diffraction. In TENCON 2010 - 2010 IEEE Region 10 Conference (pp. 1905-1908). [5686422] https://doi.org/10.1109/TENCON.2010.5686422