Suppression of Cu3Sn with Ni in high Cu containing Sn-Cu solder alloys

Kazuhiro Nogita; Benjamin Kefford; Jonathan Read; Stuart D. McDonald

doi:10.4028/www.scientific.net/MSF.857.53

Suppression of Cu₃Sn with Ni in high Cu containing Sn-Cu solder alloys

Kazuhiro Nogita, Benjamin Kefford, Jonathan Read, Stuart D. McDonald

Faculty of Engineering

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

3 Citations (Scopus)

Abstract

This research examines the relationship between Cu and Ni concentration and the formation of primary Cu₃Sn in high Cu containing Sn-Cu solder alloys. Through thermal analysis and optical microscopy, it was determined that Ni additions still have a significant effect in minimising or eliminating Cu₃Sn for Cu concentrations as high as 30wt%. In addition, it is clear that a relationship exists between Cu concentration and the effect of Ni addition and the volume fraction of Cu₃Sn increases as the Cu content increases. It is likely that the Ni addition has a significant effect on the interdiffusional coefficients of the diffusing species of Cu₃Sn and Cu₆Sn₅, slowing the growth of Cu₃Sn and encouraging primary Cu₆Sn₅ nucleation.

Original language	English
Title of host publication	Advanced Materials Engineering and Technology IV
Editors	Mohd Mustafa Al Bakri Abdullah, Rafiza Abd Razak, Muhammad Faheem Mohd Tahir, Mohd Mustafa Al Bakri Abdullah, Rafiza Abd Razak, Liyana Jamaludin
Publisher	Trans Tech Publications Ltd
Pages	53-57
Number of pages	5
ISBN (Print)	9783035710205
DOIs	https://doi.org/10.4028/www.scientific.net/MSF.857.53
Publication status	Published - 2016
Event	International Conference on Advanced Materials Engineering and Technology, ICAMET 2015 - Kaohsiung, Taiwan, Province of China Duration: Dec 4 2015 → Dec 5 2015

Publication series

Name	Materials Science Forum
Volume	857
ISSN (Print)	0255-5476
ISSN (Electronic)	1662-9752

Other

Other	International Conference on Advanced Materials Engineering and Technology, ICAMET 2015
Country/Territory	Taiwan, Province of China
City	Kaohsiung
Period	12/4/15 → 12/5/15

All Science Journal Classification (ASJC) codes

Materials Science(all)
Condensed Matter Physics
Mechanics of Materials
Mechanical Engineering

Access to Document

10.4028/www.scientific.net/MSF.857.53

Cite this

Nogita, K., Kefford, B., Read, J., & McDonald, S. D. (2016). Suppression of Cu₃Sn with Ni in high Cu containing Sn-Cu solder alloys. In M. M. Al Bakri Abdullah, R. A. Razak, M. F. M. Tahir, M. M. Al Bakri Abdullah, R. A. Razak, & L. Jamaludin (Eds.), Advanced Materials Engineering and Technology IV (pp. 53-57). (Materials Science Forum; Vol. 857). Trans Tech Publications Ltd. https://doi.org/10.4028/www.scientific.net/MSF.857.53

Suppression of Cu₃Sn with Ni in high Cu containing Sn-Cu solder alloys. / Nogita, Kazuhiro; Kefford, Benjamin; Read, Jonathan et al.

Advanced Materials Engineering and Technology IV. ed. / Mohd Mustafa Al Bakri Abdullah; Rafiza Abd Razak; Muhammad Faheem Mohd Tahir; Mohd Mustafa Al Bakri Abdullah; Rafiza Abd Razak; Liyana Jamaludin. Trans Tech Publications Ltd, 2016. p. 53-57 (Materials Science Forum; Vol. 857).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Nogita, K, Kefford, B, Read, J & McDonald, SD 2016, Suppression of Cu₃Sn with Ni in high Cu containing Sn-Cu solder alloys. in MM Al Bakri Abdullah, RA Razak, MFM Tahir, MM Al Bakri Abdullah, RA Razak & L Jamaludin (eds), Advanced Materials Engineering and Technology IV. Materials Science Forum, vol. 857, Trans Tech Publications Ltd, pp. 53-57, International Conference on Advanced Materials Engineering and Technology, ICAMET 2015, Kaohsiung, Taiwan, Province of China, 12/4/15. https://doi.org/10.4028/www.scientific.net/MSF.857.53

Nogita K, Kefford B, Read J, McDonald SD. Suppression of Cu₃Sn with Ni in high Cu containing Sn-Cu solder alloys. In Al Bakri Abdullah MM, Razak RA, Tahir MFM, Al Bakri Abdullah MM, Razak RA, Jamaludin L, editors, Advanced Materials Engineering and Technology IV. Trans Tech Publications Ltd. 2016. p. 53-57. (Materials Science Forum). doi: 10.4028/www.scientific.net/MSF.857.53

Nogita, Kazuhiro ; Kefford, Benjamin ; Read, Jonathan et al. / Suppression of Cu₃Sn with Ni in high Cu containing Sn-Cu solder alloys. Advanced Materials Engineering and Technology IV. editor / Mohd Mustafa Al Bakri Abdullah ; Rafiza Abd Razak ; Muhammad Faheem Mohd Tahir ; Mohd Mustafa Al Bakri Abdullah ; Rafiza Abd Razak ; Liyana Jamaludin. Trans Tech Publications Ltd, 2016. pp. 53-57 (Materials Science Forum).

@inproceedings{3841957aaaa04beda96903bfadb58206,

title = "Suppression of Cu3Sn with Ni in high Cu containing Sn-Cu solder alloys",

abstract = "This research examines the relationship between Cu and Ni concentration and the formation of primary Cu3Sn in high Cu containing Sn-Cu solder alloys. Through thermal analysis and optical microscopy, it was determined that Ni additions still have a significant effect in minimising or eliminating Cu3Sn for Cu concentrations as high as 30wt%. In addition, it is clear that a relationship exists between Cu concentration and the effect of Ni addition and the volume fraction of Cu3Sn increases as the Cu content increases. It is likely that the Ni addition has a significant effect on the interdiffusional coefficients of the diffusing species of Cu3Sn and Cu6Sn5, slowing the growth of Cu3Sn and encouraging primary Cu6Sn5 nucleation.",

author = "Kazuhiro Nogita and Benjamin Kefford and Jonathan Read and McDonald, {Stuart D.}",

year = "2016",

doi = "10.4028/www.scientific.net/MSF.857.53",

language = "English",

isbn = "9783035710205",

series = "Materials Science Forum",

publisher = "Trans Tech Publications Ltd",

pages = "53--57",

editor = "{Al Bakri Abdullah}, {Mohd Mustafa} and Razak, {Rafiza Abd} and Tahir, {Muhammad Faheem Mohd} and {Al Bakri Abdullah}, {Mohd Mustafa} and Razak, {Rafiza Abd} and Liyana Jamaludin",

booktitle = "Advanced Materials Engineering and Technology IV",

note = "International Conference on Advanced Materials Engineering and Technology, ICAMET 2015 ; Conference date: 04-12-2015 Through 05-12-2015",

}

TY - GEN

T1 - Suppression of Cu3Sn with Ni in high Cu containing Sn-Cu solder alloys

AU - Nogita, Kazuhiro

AU - Kefford, Benjamin

AU - Read, Jonathan

AU - McDonald, Stuart D.

PY - 2016

Y1 - 2016

N2 - This research examines the relationship between Cu and Ni concentration and the formation of primary Cu3Sn in high Cu containing Sn-Cu solder alloys. Through thermal analysis and optical microscopy, it was determined that Ni additions still have a significant effect in minimising or eliminating Cu3Sn for Cu concentrations as high as 30wt%. In addition, it is clear that a relationship exists between Cu concentration and the effect of Ni addition and the volume fraction of Cu3Sn increases as the Cu content increases. It is likely that the Ni addition has a significant effect on the interdiffusional coefficients of the diffusing species of Cu3Sn and Cu6Sn5, slowing the growth of Cu3Sn and encouraging primary Cu6Sn5 nucleation.

AB - This research examines the relationship between Cu and Ni concentration and the formation of primary Cu3Sn in high Cu containing Sn-Cu solder alloys. Through thermal analysis and optical microscopy, it was determined that Ni additions still have a significant effect in minimising or eliminating Cu3Sn for Cu concentrations as high as 30wt%. In addition, it is clear that a relationship exists between Cu concentration and the effect of Ni addition and the volume fraction of Cu3Sn increases as the Cu content increases. It is likely that the Ni addition has a significant effect on the interdiffusional coefficients of the diffusing species of Cu3Sn and Cu6Sn5, slowing the growth of Cu3Sn and encouraging primary Cu6Sn5 nucleation.

UR - http://www.scopus.com/inward/record.url?scp=84961262741&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=84961262741&partnerID=8YFLogxK

U2 - 10.4028/www.scientific.net/MSF.857.53

DO - 10.4028/www.scientific.net/MSF.857.53

M3 - Conference contribution

AN - SCOPUS:84961262741

SN - 9783035710205

T3 - Materials Science Forum

SP - 53

EP - 57

BT - Advanced Materials Engineering and Technology IV

A2 - Al Bakri Abdullah, Mohd Mustafa

A2 - Razak, Rafiza Abd

A2 - Tahir, Muhammad Faheem Mohd

A2 - Al Bakri Abdullah, Mohd Mustafa

A2 - Razak, Rafiza Abd

A2 - Jamaludin, Liyana

PB - Trans Tech Publications Ltd

T2 - International Conference on Advanced Materials Engineering and Technology, ICAMET 2015

Y2 - 4 December 2015 through 5 December 2015

ER -