Suppression of Cu3Sn with Ni in high Cu containing Sn-Cu solder alloys

Kazuhiro Nogita, Benjamin Kefford, Jonathan Read, Stuart D. McDonald

Research output: Chapter in Book/Report/Conference proceedingConference contribution

2 Citations (Scopus)

Abstract

This research examines the relationship between Cu and Ni concentration and the formation of primary Cu3Sn in high Cu containing Sn-Cu solder alloys. Through thermal analysis and optical microscopy, it was determined that Ni additions still have a significant effect in minimising or eliminating Cu3Sn for Cu concentrations as high as 30wt%. In addition, it is clear that a relationship exists between Cu concentration and the effect of Ni addition and the volume fraction of Cu3Sn increases as the Cu content increases. It is likely that the Ni addition has a significant effect on the interdiffusional coefficients of the diffusing species of Cu3Sn and Cu6Sn5, slowing the growth of Cu3Sn and encouraging primary Cu6Sn5 nucleation.

Original languageEnglish
Title of host publicationAdvanced Materials Engineering and Technology IV
EditorsMohd Mustafa Al Bakri Abdullah, Rafiza Abd Razak, Muhammad Faheem Mohd Tahir, Mohd Mustafa Al Bakri Abdullah, Rafiza Abd Razak, Liyana Jamaludin
PublisherTrans Tech Publications Ltd
Pages53-57
Number of pages5
ISBN (Print)9783035710205
DOIs
Publication statusPublished - Jan 1 2016
EventInternational Conference on Advanced Materials Engineering and Technology, ICAMET 2015 - Kaohsiung, Taiwan, Province of China
Duration: Dec 4 2015Dec 5 2015

Publication series

NameMaterials Science Forum
Volume857
ISSN (Print)0255-5476

Other

OtherInternational Conference on Advanced Materials Engineering and Technology, ICAMET 2015
CountryTaiwan, Province of China
CityKaohsiung
Period12/4/1512/5/15

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All Science Journal Classification (ASJC) codes

  • Materials Science(all)
  • Condensed Matter Physics
  • Mechanics of Materials
  • Mechanical Engineering

Cite this

Nogita, K., Kefford, B., Read, J., & McDonald, S. D. (2016). Suppression of Cu3Sn with Ni in high Cu containing Sn-Cu solder alloys. In M. M. Al Bakri Abdullah, R. A. Razak, M. F. M. Tahir, M. M. Al Bakri Abdullah, R. A. Razak, & L. Jamaludin (Eds.), Advanced Materials Engineering and Technology IV (pp. 53-57). (Materials Science Forum; Vol. 857). Trans Tech Publications Ltd. https://doi.org/10.4028/www.scientific.net/MSF.857.53