Suppression of Cu6Sn5 in TiO2 reinforced solder joints after multiple reflow cycles

M. A.A. Mohd Salleh, S. D. McDonald, C. M. Gourlay, H. Yasuda, K. Nogita

Research output: Contribution to journalArticlepeer-review

34 Citations (Scopus)

Fingerprint Dive into the research topics of 'Suppression of Cu<sub>6</sub>Sn<sub>5</sub> in TiO<sub>2</sub> reinforced solder joints after multiple reflow cycles'. Together they form a unique fingerprint.

Chemical Compounds

Engineering & Materials Science