Surface activated flip-chip bonding of laser chips

Eiji Higurashi, Tadatomo Suga, Masao Nakagawa, Renshi Sawada

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

This paper reports the results of low-temperature flip-chip bonding of a vertical cavity surface emitting laser (VCSEL) on a micromachined Si substrate. Low temperature bonding was achieved by introducing the surface activation by plasma irradiation into the flip-chip bonding process. After the surfaces of the Au electrodes of the VCSEL and Si substrate were cleaned using an Ar radio frequency (RF) plasma, Au-Au bonding was carried out only by contact in ambient air with applied static pressure. At a bonding temperature of 100°C, the die-shear strength exceeded the failure criteria of MIL-STD-883.

Original languageEnglish
Title of host publicationProceedings of the ASME/Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems: Advances in Electronic Packaging 2005
Pages793-796
Number of pages4
VolumePART A
Publication statusPublished - 2005
EventASME/Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems: Advances in Electronic Packaging 2005 - San Francisco, CA, United States
Duration: Jul 17 2005Jul 22 2005

Other

OtherASME/Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems: Advances in Electronic Packaging 2005
CountryUnited States
CitySan Francisco, CA
Period7/17/057/22/05

Fingerprint

Lasers
Surface emitting lasers
Plasmas
Substrates
Shear strength
Contacts (fluid mechanics)
Temperature
Chemical activation
Irradiation
Electrodes
Air

All Science Journal Classification (ASJC) codes

  • Engineering(all)

Cite this

Higurashi, E., Suga, T., Nakagawa, M., & Sawada, R. (2005). Surface activated flip-chip bonding of laser chips. In Proceedings of the ASME/Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems: Advances in Electronic Packaging 2005 (Vol. PART A, pp. 793-796)

Surface activated flip-chip bonding of laser chips. / Higurashi, Eiji; Suga, Tadatomo; Nakagawa, Masao; Sawada, Renshi.

Proceedings of the ASME/Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems: Advances in Electronic Packaging 2005. Vol. PART A 2005. p. 793-796.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Higurashi, E, Suga, T, Nakagawa, M & Sawada, R 2005, Surface activated flip-chip bonding of laser chips. in Proceedings of the ASME/Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems: Advances in Electronic Packaging 2005. vol. PART A, pp. 793-796, ASME/Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems: Advances in Electronic Packaging 2005, San Francisco, CA, United States, 7/17/05.
Higurashi E, Suga T, Nakagawa M, Sawada R. Surface activated flip-chip bonding of laser chips. In Proceedings of the ASME/Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems: Advances in Electronic Packaging 2005. Vol. PART A. 2005. p. 793-796
Higurashi, Eiji ; Suga, Tadatomo ; Nakagawa, Masao ; Sawada, Renshi. / Surface activated flip-chip bonding of laser chips. Proceedings of the ASME/Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems: Advances in Electronic Packaging 2005. Vol. PART A 2005. pp. 793-796
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