TY - JOUR
T1 - Surface analysis of the chemical polishing process using a fullerenol slurry by Raman spectroscopy under surface plasmon excitation
AU - Takaya, Yasuhiro
AU - Michihata, Masaki
AU - Hayashi, Terutake
AU - Murai, Ryota
AU - Kano, Kazumasa
N1 - Funding Information:
This research was supported by a MEXT Grant-in-Aid for Challenging Exploratory Research, No. 24656104 , 2012.
PY - 2013
Y1 - 2013
N2 - In Cu-CMP using a fullerenol slurry, effective planarization in terms of high removal rate has been confirmed. The high chemical reactivity of fullerenol is suggested to be an essential factor for copper material removal. In situ surface analysis based on the SERS method was performed to reveal the role of the copper-fullerenol interaction in the chemical reaction process during Cu-CMP. A series of SERS Raman spectra suggested that a reacted thin film formed on the copper surface, which was measured using a custom-built measurement system.
AB - In Cu-CMP using a fullerenol slurry, effective planarization in terms of high removal rate has been confirmed. The high chemical reactivity of fullerenol is suggested to be an essential factor for copper material removal. In situ surface analysis based on the SERS method was performed to reveal the role of the copper-fullerenol interaction in the chemical reaction process during Cu-CMP. A series of SERS Raman spectra suggested that a reacted thin film formed on the copper surface, which was measured using a custom-built measurement system.
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U2 - 10.1016/j.cirp.2013.03.019
DO - 10.1016/j.cirp.2013.03.019
M3 - Article
AN - SCOPUS:84878862640
SN - 0007-8506
VL - 62
SP - 571
EP - 574
JO - CIRP Annals - Manufacturing Technology
JF - CIRP Annals - Manufacturing Technology
IS - 1
ER -