Surface analysis of the chemical polishing process using a fullerenol slurry by Raman spectroscopy under surface plasmon excitation

Yasuhiro Takaya, Masaki Michihata, Terutake Hayashi, Ryota Murai, Kazumasa Kano

Research output: Contribution to journalArticle

3 Citations (Scopus)

Abstract

In Cu-CMP using a fullerenol slurry, effective planarization in terms of high removal rate has been confirmed. The high chemical reactivity of fullerenol is suggested to be an essential factor for copper material removal. In situ surface analysis based on the SERS method was performed to reveal the role of the copper-fullerenol interaction in the chemical reaction process during Cu-CMP. A series of SERS Raman spectra suggested that a reacted thin film formed on the copper surface, which was measured using a custom-built measurement system.

Original languageEnglish
Pages (from-to)571-574
Number of pages4
JournalCIRP Annals - Manufacturing Technology
Volume62
Issue number1
DOIs
Publication statusPublished - Apr 25 2013
Externally publishedYes

All Science Journal Classification (ASJC) codes

  • Mechanical Engineering
  • Industrial and Manufacturing Engineering

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