Surface-layer microstructure control by high-frequency induction heating in metastable austenitic stainless steel

Toshihiro Tsuchiyma, Takanori Tsurumaru, Koichi Nakashima, Setsuo Takaki, Hirokazu Inaba, Yoshitaka Misaka

    Research output: Chapter in Book/Report/Conference proceedingConference contribution

    Abstract

    To suppress hydrogen permeation from environment into cold-worked high strength austenitic stainless steel, the surface heat treatment using high-frequency induction heating was applied to a cord-drawn metastable austenitic stainless steel (Fe-16Cr-10Ni alloy). By this heat treatment, the microstructure in the surface-layer (1mm depth) was controlled to austenite, while the inside of the material was strengthened by a large fraction of deformation-induced martensite. TDS analysis for the cathodically charged specimen revealed that hydrogen permeation was significantly retarded and no diffusible hydrogen existed. These results suggest that hydrogen embrittlement can be avoided by covering the material surface with austenite phase even in cold-worked high strength austenitic stainless steel.

    Original languageEnglish
    Title of host publication65th ABM International Congress, 18th IFHTSE Congress and 1st TMS/ABM International Materials Congress 2010
    Pages4134-4143
    Number of pages10
    Volume5
    Publication statusPublished - Dec 1 2010
    Event65th ABM International Congress, 18th IFHTSE Congress and 1st TMS/ABM International Materials Congress 2010 - Rio de Janeiro, Brazil
    Duration: Jul 26 2010Jul 30 2010

    Other

    Other65th ABM International Congress, 18th IFHTSE Congress and 1st TMS/ABM International Materials Congress 2010
    CountryBrazil
    CityRio de Janeiro
    Period7/26/107/30/10

    All Science Journal Classification (ASJC) codes

    • Mechanics of Materials

    Fingerprint Dive into the research topics of 'Surface-layer microstructure control by high-frequency induction heating in metastable austenitic stainless steel'. Together they form a unique fingerprint.

    Cite this