超40Gb/s IC用表面実装技術の開発

Translated title of the contribution: Surface Mount Technology for Over-40-Gb/s ICs

菅原 裕彦, 木村 俊二, 村田 浩一, 富山 裕之, 佐野 栄一

Research output: Contribution to journalArticle

Abstract

A new surface mount technology for over-40-Gb/s ICs has been developed. The technology features 8-mm-square leadless chip carrier packages and four-layer resin printed circuit boards. It was applied to build a prototype InP HFET multichip 1 : 4 DEMUX module, that operates at 45 Gb/s. This technology is promising for small, low-cost IC modules for over-40-Gb/s optical communication systems.
Translated title of the contributionSurface Mount Technology for Over-40-Gb/s ICs
Original languageJapanese
Pages (from-to)43-47
Number of pages5
JournalIEICE technical report
Volume101
Issue number555
Publication statusPublished - Jan 9 2002

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