Surface passivation of Cu cone bump by self-assembled-monolayer for room temperature Cu-Cu bonding

A. Ikeda, L. J. Qiu, K. Nakahara, Tanemasa Asano

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

Cu-Cu room temperature bonding is investigated using Cu cone bumps with SAM passivation. Effect of the SAM passivation for preventing the Cu oxidation is confirmed by AES and water contact angle measurements. The contact resistance at the bump interconnection is kept small even with 24 hours storage in air after the SAM passivation. Also, the die shear strength of the bonded chip is enough high to satisfy the criterion of MIL-STD. According to these findings, we can conclude that the Cu cone bump with the SAM passivation is promising candidate for room temperature Cu-Cu bump interconnections.

Original languageEnglish
Title of host publication2013 IEEE International 3D Systems Integration Conference, 3DIC 2013
DOIs
Publication statusPublished - 2013
Event2013 IEEE International 3D Systems Integration Conference, 3DIC 2013 - San Francisco, CA, United States
Duration: Oct 2 2013Oct 4 2013

Other

Other2013 IEEE International 3D Systems Integration Conference, 3DIC 2013
CountryUnited States
CitySan Francisco, CA
Period10/2/1310/4/13

Fingerprint

Self assembled monolayers
Passivation
Cones
Temperature
Contact resistance
Angle measurement
Shear strength
Contact angle
Oxidation
Air
Water

All Science Journal Classification (ASJC) codes

  • Computer Graphics and Computer-Aided Design
  • Computer Science Applications

Cite this

Ikeda, A., Qiu, L. J., Nakahara, K., & Asano, T. (2013). Surface passivation of Cu cone bump by self-assembled-monolayer for room temperature Cu-Cu bonding. In 2013 IEEE International 3D Systems Integration Conference, 3DIC 2013 [6702317] https://doi.org/10.1109/3DIC.2013.6702317

Surface passivation of Cu cone bump by self-assembled-monolayer for room temperature Cu-Cu bonding. / Ikeda, A.; Qiu, L. J.; Nakahara, K.; Asano, Tanemasa.

2013 IEEE International 3D Systems Integration Conference, 3DIC 2013. 2013. 6702317.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Ikeda, A, Qiu, LJ, Nakahara, K & Asano, T 2013, Surface passivation of Cu cone bump by self-assembled-monolayer for room temperature Cu-Cu bonding. in 2013 IEEE International 3D Systems Integration Conference, 3DIC 2013., 6702317, 2013 IEEE International 3D Systems Integration Conference, 3DIC 2013, San Francisco, CA, United States, 10/2/13. https://doi.org/10.1109/3DIC.2013.6702317
Ikeda A, Qiu LJ, Nakahara K, Asano T. Surface passivation of Cu cone bump by self-assembled-monolayer for room temperature Cu-Cu bonding. In 2013 IEEE International 3D Systems Integration Conference, 3DIC 2013. 2013. 6702317 https://doi.org/10.1109/3DIC.2013.6702317
Ikeda, A. ; Qiu, L. J. ; Nakahara, K. ; Asano, Tanemasa. / Surface passivation of Cu cone bump by self-assembled-monolayer for room temperature Cu-Cu bonding. 2013 IEEE International 3D Systems Integration Conference, 3DIC 2013. 2013.
@inproceedings{19b55ea2ff0c4e3a9d7269e43195523b,
title = "Surface passivation of Cu cone bump by self-assembled-monolayer for room temperature Cu-Cu bonding",
abstract = "Cu-Cu room temperature bonding is investigated using Cu cone bumps with SAM passivation. Effect of the SAM passivation for preventing the Cu oxidation is confirmed by AES and water contact angle measurements. The contact resistance at the bump interconnection is kept small even with 24 hours storage in air after the SAM passivation. Also, the die shear strength of the bonded chip is enough high to satisfy the criterion of MIL-STD. According to these findings, we can conclude that the Cu cone bump with the SAM passivation is promising candidate for room temperature Cu-Cu bump interconnections.",
author = "A. Ikeda and Qiu, {L. J.} and K. Nakahara and Tanemasa Asano",
year = "2013",
doi = "10.1109/3DIC.2013.6702317",
language = "English",
isbn = "9781467364843",
booktitle = "2013 IEEE International 3D Systems Integration Conference, 3DIC 2013",

}

TY - GEN

T1 - Surface passivation of Cu cone bump by self-assembled-monolayer for room temperature Cu-Cu bonding

AU - Ikeda, A.

AU - Qiu, L. J.

AU - Nakahara, K.

AU - Asano, Tanemasa

PY - 2013

Y1 - 2013

N2 - Cu-Cu room temperature bonding is investigated using Cu cone bumps with SAM passivation. Effect of the SAM passivation for preventing the Cu oxidation is confirmed by AES and water contact angle measurements. The contact resistance at the bump interconnection is kept small even with 24 hours storage in air after the SAM passivation. Also, the die shear strength of the bonded chip is enough high to satisfy the criterion of MIL-STD. According to these findings, we can conclude that the Cu cone bump with the SAM passivation is promising candidate for room temperature Cu-Cu bump interconnections.

AB - Cu-Cu room temperature bonding is investigated using Cu cone bumps with SAM passivation. Effect of the SAM passivation for preventing the Cu oxidation is confirmed by AES and water contact angle measurements. The contact resistance at the bump interconnection is kept small even with 24 hours storage in air after the SAM passivation. Also, the die shear strength of the bonded chip is enough high to satisfy the criterion of MIL-STD. According to these findings, we can conclude that the Cu cone bump with the SAM passivation is promising candidate for room temperature Cu-Cu bump interconnections.

UR - http://www.scopus.com/inward/record.url?scp=84893912140&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=84893912140&partnerID=8YFLogxK

U2 - 10.1109/3DIC.2013.6702317

DO - 10.1109/3DIC.2013.6702317

M3 - Conference contribution

AN - SCOPUS:84893912140

SN - 9781467364843

BT - 2013 IEEE International 3D Systems Integration Conference, 3DIC 2013

ER -