Surface passivation of Cu cone bump by self-assembled-monolayer for room temperature Cu-Cu bonding

A. Ikeda, L. J. Qiu, K. Nakahara, Tanemasa Asano

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

Cu-Cu room temperature bonding is investigated using Cu cone bumps with SAM passivation. Effect of the SAM passivation for preventing the Cu oxidation is confirmed by AES and water contact angle measurements. The contact resistance at the bump interconnection is kept small even with 24 hours storage in air after the SAM passivation. Also, the die shear strength of the bonded chip is enough high to satisfy the criterion of MIL-STD. According to these findings, we can conclude that the Cu cone bump with the SAM passivation is promising candidate for room temperature Cu-Cu bump interconnections.

Original languageEnglish
Title of host publication2013 IEEE International 3D Systems Integration Conference, 3DIC 2013
DOIs
Publication statusPublished - 2013
Event2013 IEEE International 3D Systems Integration Conference, 3DIC 2013 - San Francisco, CA, United States
Duration: Oct 2 2013Oct 4 2013

Other

Other2013 IEEE International 3D Systems Integration Conference, 3DIC 2013
CountryUnited States
CitySan Francisco, CA
Period10/2/1310/4/13

All Science Journal Classification (ASJC) codes

  • Computer Graphics and Computer-Aided Design
  • Computer Science Applications

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