Surface protection of copper by self assembled monolayer for low-temperature chip bonding

Lijing Qiu, Kiyoaki Nakahara, Akihiro Ikeda, Tanemasa Asano

Research output: Chapter in Book/Report/Conference proceedingConference contribution

1 Citation (Scopus)

Abstract

To protect the surface of electroplated Cu from contamination such as oxidation, coating of the surface with a self-assembled monolayer (SAM) was investigated. The coating material investigated was 1-Hexanethiol. Auger electron spectroscopy showed that the SAM coating definitely reduced the oxidation rate of the Cu surface. Change in surface contamination with elevating temperature in the ambient was investigated by measuring wetting angle of water. It showed that the surface protection is kept up to about 100C. Also, we applied this coating to Cu cone-shaped bump.

Original languageEnglish
Title of host publicationProceedings of 2012 3rd IEEE International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2012
Pages75-78
Number of pages4
DOIs
Publication statusPublished - Aug 15 2012
Event2012 3rd IEEE International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2012 - Tokyo, Japan
Duration: May 22 2012May 23 2012

Publication series

NameProceedings of 2012 3rd IEEE International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2012

Other

Other2012 3rd IEEE International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2012
CountryJapan
CityTokyo
Period5/22/125/23/12

All Science Journal Classification (ASJC) codes

  • Computer Graphics and Computer-Aided Design
  • Computer Vision and Pattern Recognition

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