Synergistic effect of additives on the surface roughness and throwing power of copper deposited from electrorefining solution

Atsuhiro Suzuki, Satoshi Oue, Shigeo Kobayashi, Hiroaki Nakano

Research output: Contribution to journalArticle

Abstract

To elucidate the synergistic effect of gelatin, thiourea and chloride ions on the surface roughness, throwing power and polarization curves for Cu deposition from electrorefining solution, Cu electrodeposition was performed at a current density of 200 A•m-2 and 5×105 C•m-2 of charge in an unagitated sulfate solution containing 0.708 mol•dm-3 of CuSO4 and 2.04 mol•dm-3 of H2SO4 at a temperature of 60°C. In solutions containing three kinds of additives such as gelatin, thiourea and chloride ions, the surface roughness of deposited Cu decreased with increasing the concentration of thiouea and gelatin and decreasing the chloride ions. On the other hand, the throwing power of deposited Cu was improved with decrease in thiourea and increase in gelatin in solutions containing three kinds of additives. The throwing power of deposited Cu was significantly improved in solution containing both gelatin and chloride ions. The polarization resistance dE/di for Cu deposition increased in solution containing both gelatin and chloride ions, which resulting in improvement of throwing power of Cu deposition. As small amounts of thiourea have a depolarization effect on Cu deposition, a leveling effect is expected owing to the promotion of deposition at recesses.

Original languageEnglish
Pages (from-to)358-365
Number of pages8
JournalNippon Kinzoku Gakkaishi/Journal of the Japan Institute of Metals
Volume81
Issue number7
DOIs
Publication statusPublished - Jan 1 2017

Fingerprint

electrorefining
throwing
gelatins
Gelatin
Copper
Thiourea
surface roughness
Thioureas
Surface roughness
thioureas
Chlorides
copper
chlorides
Ions
ions
Polarization
recesses
leveling
Depolarization
promotion

All Science Journal Classification (ASJC) codes

  • Condensed Matter Physics
  • Mechanics of Materials
  • Metals and Alloys
  • Materials Chemistry

Cite this

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title = "Synergistic effect of additives on the surface roughness and throwing power of copper deposited from electrorefining solution",
abstract = "To elucidate the synergistic effect of gelatin, thiourea and chloride ions on the surface roughness, throwing power and polarization curves for Cu deposition from electrorefining solution, Cu electrodeposition was performed at a current density of 200 A•m-2 and 5×105 C•m-2 of charge in an unagitated sulfate solution containing 0.708 mol•dm-3 of CuSO4 and 2.04 mol•dm-3 of H2SO4 at a temperature of 60°C. In solutions containing three kinds of additives such as gelatin, thiourea and chloride ions, the surface roughness of deposited Cu decreased with increasing the concentration of thiouea and gelatin and decreasing the chloride ions. On the other hand, the throwing power of deposited Cu was improved with decrease in thiourea and increase in gelatin in solutions containing three kinds of additives. The throwing power of deposited Cu was significantly improved in solution containing both gelatin and chloride ions. The polarization resistance dE/di for Cu deposition increased in solution containing both gelatin and chloride ions, which resulting in improvement of throwing power of Cu deposition. As small amounts of thiourea have a depolarization effect on Cu deposition, a leveling effect is expected owing to the promotion of deposition at recesses.",
author = "Atsuhiro Suzuki and Satoshi Oue and Shigeo Kobayashi and Hiroaki Nakano",
year = "2017",
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T1 - Synergistic effect of additives on the surface roughness and throwing power of copper deposited from electrorefining solution

AU - Suzuki, Atsuhiro

AU - Oue, Satoshi

AU - Kobayashi, Shigeo

AU - Nakano, Hiroaki

PY - 2017/1/1

Y1 - 2017/1/1

N2 - To elucidate the synergistic effect of gelatin, thiourea and chloride ions on the surface roughness, throwing power and polarization curves for Cu deposition from electrorefining solution, Cu electrodeposition was performed at a current density of 200 A•m-2 and 5×105 C•m-2 of charge in an unagitated sulfate solution containing 0.708 mol•dm-3 of CuSO4 and 2.04 mol•dm-3 of H2SO4 at a temperature of 60°C. In solutions containing three kinds of additives such as gelatin, thiourea and chloride ions, the surface roughness of deposited Cu decreased with increasing the concentration of thiouea and gelatin and decreasing the chloride ions. On the other hand, the throwing power of deposited Cu was improved with decrease in thiourea and increase in gelatin in solutions containing three kinds of additives. The throwing power of deposited Cu was significantly improved in solution containing both gelatin and chloride ions. The polarization resistance dE/di for Cu deposition increased in solution containing both gelatin and chloride ions, which resulting in improvement of throwing power of Cu deposition. As small amounts of thiourea have a depolarization effect on Cu deposition, a leveling effect is expected owing to the promotion of deposition at recesses.

AB - To elucidate the synergistic effect of gelatin, thiourea and chloride ions on the surface roughness, throwing power and polarization curves for Cu deposition from electrorefining solution, Cu electrodeposition was performed at a current density of 200 A•m-2 and 5×105 C•m-2 of charge in an unagitated sulfate solution containing 0.708 mol•dm-3 of CuSO4 and 2.04 mol•dm-3 of H2SO4 at a temperature of 60°C. In solutions containing three kinds of additives such as gelatin, thiourea and chloride ions, the surface roughness of deposited Cu decreased with increasing the concentration of thiouea and gelatin and decreasing the chloride ions. On the other hand, the throwing power of deposited Cu was improved with decrease in thiourea and increase in gelatin in solutions containing three kinds of additives. The throwing power of deposited Cu was significantly improved in solution containing both gelatin and chloride ions. The polarization resistance dE/di for Cu deposition increased in solution containing both gelatin and chloride ions, which resulting in improvement of throwing power of Cu deposition. As small amounts of thiourea have a depolarization effect on Cu deposition, a leveling effect is expected owing to the promotion of deposition at recesses.

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