Synergistic effects of additives on the deposition behavior, throwing power and surface roughness of Cu obtained from electrorefining solution

Atsuhiro Suzuki, Satoshi Oue, Hiroaki Nakano

    Research output: Contribution to journalArticlepeer-review

    Abstract

    To elucidate the synergistic effects of gelatin, thiourea, and chloride ions on the deposition behavior, throwing power, and surface roughness of Cu obtained from electrorefining solutions, Cu electrodeposition was performed at a current density of 200 A·m12 and a charge of 5

    Original languageEnglish
    Pages (from-to)972-979
    Number of pages8
    JournalMaterials Transactions
    Volume61
    Issue number5
    DOIs
    Publication statusPublished - 2020

    All Science Journal Classification (ASJC) codes

    • Materials Science(all)
    • Condensed Matter Physics
    • Mechanics of Materials
    • Mechanical Engineering

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