Synergistic effects of additives on the deposition behavior, throwing power and surface roughness of Cu obtained from electrorefining solution

Atsuhiro Suzuki, Satoshi Oue, Hiroaki Nakano

Research output: Contribution to journalArticle

Abstract

To elucidate the synergistic effects of gelatin, thiourea, and chloride ions on the deposition behavior, throwing power, and surface roughness of Cu obtained from electrorefining solutions, Cu electrodeposition was performed at a current density of 200 A·m12 and a charge of 5

Original languageEnglish
Pages (from-to)972-979
Number of pages8
JournalMaterials Transactions
Volume61
Issue number5
DOIs
Publication statusPublished - Jan 1 2020

All Science Journal Classification (ASJC) codes

  • Materials Science(all)
  • Condensed Matter Physics
  • Mechanics of Materials
  • Mechanical Engineering

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