TEM-EDX observations of the microstructure of electrodeposited Ni-Sn alloys

Satoshi Oue, Hiroaki Nakano, Ryo Kuroda, Shigeo Kobayashi, Hisaaki Fukushima

Research output: Contribution to journalArticlepeer-review

7 Citations (Scopus)

Abstract

The microstructure of Ni-Sn alloys electrodeposited at 50-5000 A/m 2 from 65°C chloride solutions containing 5-40 metal% of Sn were analyzed by TEM-EDX. Ni-Sn alloy deposition showed a characteristic behavior in that Ni and Sn were codeposited at an atomic ratio of 1:1 under a wide range of solution compositions and current densities. Ni and Sn EDX mapping images of a cross section of Ni-50 at% Sn alloy deposited at over 1000 A/m 2 showed a lamellar pattern parallel to the interface between substrate and deposit, indicating the alternate deposition of Ni-Sn alloys with different compositions. The Ni-Sn alloys were identified by EDX line analysis as Ni 3Sr 4 and Ni 3Sn 2. It was concluded that Ni-50 at%Sn alloys deposited over 1000 A/m 2 were not composed of the previously reported metastable-phase NiSn single alloy, but instead consisted of both Ni 3Sn 2 and Ni 3Sn 2 alloys in a thermodynamically stable phase.

Original languageEnglish
Pages (from-to)1550-1554
Number of pages5
JournalMaterials Transactions
Volume47
Issue number6
DOIs
Publication statusPublished - Jun 1 2006

All Science Journal Classification (ASJC) codes

  • Materials Science(all)
  • Condensed Matter Physics
  • Mechanics of Materials
  • Mechanical Engineering

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