TEM-EDX observations of the microstructure of electrodeposited Ni-Sn alloys

Satoshi Oue, Hiroaki Nakano, Ryo Kuroda, Shigeo Kobayashi, Hisaaki Fukushima

Research output: Contribution to journalArticlepeer-review


The microstructure of Ni-Sn alloys electrodeposited at 65°C and in 50-5000 A/m 2 from acidic aqueous solutions containing 1.25mol/L NiCl 2 and 0.03-0.41 mol/L SnCl 2 were examined by TEM-EDX. In the Ni-Sn alloy deposition, Ni and Sn were codeposited at an atomic ratio of 1: 1 under the wide ranges of solution compositions and current densities. EDX mapping images of a cross section of Ni-50 at%Sn alloy deposited at current densities more than 1000 A/m 2 revealed a lamellar phase parallel to the interface between substrate and deposit. The lamellar phase were identified as Ni 3Sn 4 and Ni 3Sn 2 by EDX line analysis. It was concluded that the Ni-50 at%Sn alloys were not composed of the metastable-phase NiSn single alloy reported previously, but consisted of two Ni 3Sn 4 and Ni 3Sn 4 alloy phases in a thermodynamically stable instead.

Original languageEnglish
Pages (from-to)804-808
Number of pages5
JournalNippon Kinzoku Gakkaishi/Journal of the Japan Institute of Metals
Issue number10
Publication statusPublished - Oct 1 2006

All Science Journal Classification (ASJC) codes

  • Condensed Matter Physics
  • Mechanics of Materials
  • Metals and Alloys
  • Materials Chemistry

Fingerprint Dive into the research topics of 'TEM-EDX observations of the microstructure of electrodeposited Ni-Sn alloys'. Together they form a unique fingerprint.

Cite this