TEM-EDX observations of the microstructure of electrodeposited Ni-Sn alloys

Satoshi Oue, Hiroaki Nakano, Ryo Kuroda, Shigeo Kobayashi, Hisaaki Fukushima

Research output: Contribution to journalArticle

Abstract

The microstructure of Ni-Sn alloys electrodeposited at 65°C and in 50-5000 A/m 2 from acidic aqueous solutions containing 1.25mol/L NiCl 2 and 0.03-0.41 mol/L SnCl 2 were examined by TEM-EDX. In the Ni-Sn alloy deposition, Ni and Sn were codeposited at an atomic ratio of 1: 1 under the wide ranges of solution compositions and current densities. EDX mapping images of a cross section of Ni-50 at%Sn alloy deposited at current densities more than 1000 A/m 2 revealed a lamellar phase parallel to the interface between substrate and deposit. The lamellar phase were identified as Ni 3Sn 4 and Ni 3Sn 2 by EDX line analysis. It was concluded that the Ni-50 at%Sn alloys were not composed of the metastable-phase NiSn single alloy reported previously, but consisted of two Ni 3Sn 4 and Ni 3Sn 4 alloy phases in a thermodynamically stable instead.

Original languageEnglish
Pages (from-to)804-808
Number of pages5
JournalNippon Kinzoku Gakkaishi/Journal of the Japan Institute of Metals
Volume70
Issue number10
DOIs
Publication statusPublished - Oct 1 2006

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Energy dispersive spectroscopy
Transmission electron microscopy
transmission electron microscopy
microstructure
Microstructure
Current density
current density
Metastable phases
Deposits
deposits
aqueous solutions
cross sections
Substrates
Chemical analysis

All Science Journal Classification (ASJC) codes

  • Condensed Matter Physics
  • Mechanics of Materials
  • Metals and Alloys
  • Materials Chemistry

Cite this

TEM-EDX observations of the microstructure of electrodeposited Ni-Sn alloys. / Oue, Satoshi; Nakano, Hiroaki; Kuroda, Ryo; Kobayashi, Shigeo; Fukushima, Hisaaki.

In: Nippon Kinzoku Gakkaishi/Journal of the Japan Institute of Metals, Vol. 70, No. 10, 01.10.2006, p. 804-808.

Research output: Contribution to journalArticle

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AB - The microstructure of Ni-Sn alloys electrodeposited at 65°C and in 50-5000 A/m 2 from acidic aqueous solutions containing 1.25mol/L NiCl 2 and 0.03-0.41 mol/L SnCl 2 were examined by TEM-EDX. In the Ni-Sn alloy deposition, Ni and Sn were codeposited at an atomic ratio of 1: 1 under the wide ranges of solution compositions and current densities. EDX mapping images of a cross section of Ni-50 at%Sn alloy deposited at current densities more than 1000 A/m 2 revealed a lamellar phase parallel to the interface between substrate and deposit. The lamellar phase were identified as Ni 3Sn 4 and Ni 3Sn 2 by EDX line analysis. It was concluded that the Ni-50 at%Sn alloys were not composed of the metastable-phase NiSn single alloy reported previously, but consisted of two Ni 3Sn 4 and Ni 3Sn 4 alloy phases in a thermodynamically stable instead.

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