TEM study of local conduction mechanisms in model specimens of Ag-based conductive adhesive

Keita Kurosu, Naoyuki Kawamoto, Yasukazu Murakami, Daisuke Shindo

Research output: Contribution to journalArticle

3 Citations (Scopus)

Abstract

The conduction mechanisms of silver (Ag)-based conductive adhesives, which consist of metallic Ag particles and an epoxy resin, are discussed on the basis of transmission electron microscopy (TEM) studies and local conductivity measurements of model specimens. A small electrical current was observed in the model specimens, in which a thin epoxy layer was sandwiched between Ag electrodes. TEM observations demonstrated that the irreversible changes in the current versus voltage characteristics occurred along with microstructural changes in the Ag electrode, which was subjected to a large electrical current. Calculated equipotential lines indicated a considerable change in the electric field distribution near a small horn that was formed in the surface of the Ag electrode. The results provide useful information for understanding local conduction in the cured adhesive.

Original languageEnglish
Article number6111212
Pages (from-to)294-299
Number of pages6
JournalIEEE Transactions on Components, Packaging and Manufacturing Technology
Volume2
Issue number2
DOIs
Publication statusPublished - Feb 1 2012
Externally publishedYes

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Adhesives
Transmission electron microscopy
Electrodes
Epoxy Resins
Current voltage characteristics
Silver
Epoxy resins
Electric fields

All Science Journal Classification (ASJC) codes

  • Electronic, Optical and Magnetic Materials
  • Industrial and Manufacturing Engineering
  • Electrical and Electronic Engineering

Cite this

TEM study of local conduction mechanisms in model specimens of Ag-based conductive adhesive. / Kurosu, Keita; Kawamoto, Naoyuki; Murakami, Yasukazu; Shindo, Daisuke.

In: IEEE Transactions on Components, Packaging and Manufacturing Technology, Vol. 2, No. 2, 6111212, 01.02.2012, p. 294-299.

Research output: Contribution to journalArticle

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