TY - JOUR
T1 - Temperature evolution of spin relaxation in a NiFe/Cu lateral spin valve
AU - Kimura, T.
AU - Sato, T.
AU - Otani, Y.
N1 - Copyright:
Copyright 2008 Elsevier B.V., All rights reserved.
PY - 2008/2/13
Y1 - 2008/2/13
N2 - Temperature dependence of spin relaxation process in a Cu wire has been studied by means of nonlocal spin-valve measurements. The spin-diffusion length of the Cu wire is found to take maximum at the characteristic temperature, below which the spin-diffusion length is reduced. The mechanism of the reduction can be explained by considering the spin-flip scattering due to the oxidized surface of the Cu wire. The thickness dependence of the characteristic temperature supports the interpretation with the surface oxidation.
AB - Temperature dependence of spin relaxation process in a Cu wire has been studied by means of nonlocal spin-valve measurements. The spin-diffusion length of the Cu wire is found to take maximum at the characteristic temperature, below which the spin-diffusion length is reduced. The mechanism of the reduction can be explained by considering the spin-flip scattering due to the oxidized surface of the Cu wire. The thickness dependence of the characteristic temperature supports the interpretation with the surface oxidation.
UR - http://www.scopus.com/inward/record.url?scp=40849141380&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=40849141380&partnerID=8YFLogxK
U2 - 10.1103/PhysRevLett.100.066602
DO - 10.1103/PhysRevLett.100.066602
M3 - Article
AN - SCOPUS:40849141380
VL - 100
JO - Physical Review Letters
JF - Physical Review Letters
SN - 0031-9007
IS - 6
M1 - 066602
ER -