Temperature evolution of spin relaxation in a NiFe/Cu lateral spin valve

T. Kimura, T. Sato, Y. Otani

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130 Citations (Scopus)


Temperature dependence of spin relaxation process in a Cu wire has been studied by means of nonlocal spin-valve measurements. The spin-diffusion length of the Cu wire is found to take maximum at the characteristic temperature, below which the spin-diffusion length is reduced. The mechanism of the reduction can be explained by considering the spin-flip scattering due to the oxidized surface of the Cu wire. The thickness dependence of the characteristic temperature supports the interpretation with the surface oxidation.

Original languageEnglish
Article number066602
JournalPhysical review letters
Issue number6
Publication statusPublished - Feb 13 2008
Externally publishedYes

All Science Journal Classification (ASJC) codes

  • Physics and Astronomy(all)


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