Temperature measurement by using metal thin film themocouples

Koji Miyazaki, Takahiro Miike, Hiroshi Tsukamoto, Toshiaki Takamiya

Research output: Chapter in Book/Report/Conference proceedingConference contribution

3 Citations (Scopus)

Abstract

We fabricate metal thin film thermocouples (TFTCs). Au-Pt, Cu-Ni, and W-Ni are deposited on a glass plate using standard thin film processes. The dimension of thermocouple junction is 300μm × 300μm. The thermoelectric powers of TFTCs are different from those of bulk because diffusion of electrons is restricted by the very thin film. The film thickness of TFTCs is of the same order as the mean free path of electrons. However TFTCs are still useful for temperature measurements because the thermoelectric voltage is proportional to measured temperature at thermocouple junction. The response time of Au-Pt TFTCs is about 30ns when the surface of the glass is heated by a YAG pulsed laser. The result compares favorably with measurements by a thermoreflectance method We also describe W-Ni nano-TFTCs fabricated by Focused Ion Beam for the measurement of temperature distribution in a sub-micron area. In order to reduce the size of the TFTCs we employ a 3-dimensional structure.

Original languageEnglish
Title of host publicationAdvances in Electronic Packaging 2003
Subtitle of host publicationVolume 1
Pages219-223
Number of pages5
Publication statusPublished - 2003
Externally publishedYes
Event2003 International Electronic Packaging Technical Conference and Exhibition - Haui, HI, United States
Duration: Jul 6 2003Jul 11 2003

Publication series

NameAdvances in Electronic Packaging
Volume1

Conference

Conference2003 International Electronic Packaging Technical Conference and Exhibition
Country/TerritoryUnited States
CityHaui, HI
Period7/6/037/11/03

All Science Journal Classification (ASJC) codes

  • Engineering(all)
  • Electrical and Electronic Engineering
  • Electronic, Optical and Magnetic Materials

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