The effects of strong oxidizing slurry and processing atmosphere on double-sided CMP of SiC wafer

Tao Yin, Toshiro Doi, Syuhei Kurokawa, Osamu Ohnishi, Tsutomu Yamazaki, Zhida Wang, Zhe Tan

Research output: Chapter in Book/Report/Conference proceedingConference contribution

10 Citations (Scopus)

Fingerprint

Dive into the research topics of 'The effects of strong oxidizing slurry and processing atmosphere on double-sided CMP of SiC wafer'. Together they form a unique fingerprint.

Engineering

Material Science