The influence of 0-0.1 wt.% Ni on the microstructure and fluidity length of Sn-0.7Cu-xNi

Tina Ventura, Christopher M. Gourlay, Kazuhiro Nogita, Tetsuro Nishimura, Michel Rappaz, Arne K. Dahle

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Abstract

Alloys based on the Sn-0.7Cu-xNi system are potential Pb-free solders. In this paper we report on the solidification characteristics and microstructures of Sn-0.7Cu alloys containing 0-1,000 ppm nickel. The microstructural observations show that increasing the nickel content reduces the volume fraction of primary Sn, thus generating a more-eutectic microstructure. In an attempt to better understand the changes in solderability with Ni additions, fluidity tests were carried out using the Ragone method for small incremental increases in nickel content. The maximum fluidity length was found to vary strongly with nickel content. Additionally, the distribution of nickel within samples was investigated using synchrotron micro X-ray fluorescence.

Original languageEnglish
Pages (from-to)32-39
Number of pages8
JournalJournal of Electronic Materials
Volume37
Issue number1
DOIs
Publication statusPublished - Jan 1 2008

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All Science Journal Classification (ASJC) codes

  • Electronic, Optical and Magnetic Materials
  • Condensed Matter Physics
  • Electrical and Electronic Engineering
  • Materials Chemistry

Cite this

Ventura, T., Gourlay, C. M., Nogita, K., Nishimura, T., Rappaz, M., & Dahle, A. K. (2008). The influence of 0-0.1 wt.% Ni on the microstructure and fluidity length of Sn-0.7Cu-xNi. Journal of Electronic Materials, 37(1), 32-39. https://doi.org/10.1007/s11664-007-0281-7