The influence of ageing on the stabilisation of interfacial (Cu,Ni)6(Sn,Zn)5 and (Cu,Au,Ni)6Sn5 intermetallics in Pb-free Ball Grid Array (BGA) solder joints

Guang Zeng, Stuart D. McDonald, Dekui Mu, Yasuko Terada, Hideyuki Yasuda, Qinfen Gu, M. A.A.Mohd Salleh, Kazuhiro Nogita

Research output: Contribution to journalArticle

26 Citations (Scopus)

Abstract

Formation/growth behaviour, phase stability, and mechanical properties of interfacial Cu6Sn5 intermetallics influenced by micro-alloying in Pb-free solder joints, are of ongoing interest as this phase is crucial to the service reliability of solder joints. Our recent work has demonstrated that, after reflow, the homogeneously located micro-alloying elements of both Ni and Zn in interfacial (Cu,Ni)6(Sn,Zn)5 act to increase phase stability and prevent the undesirable polymorphic phase transformation of Cu6Sn5. This paper further investigates the influence of ageing on the phase stability of interfacial intermetallics containing Ni, Zn and Au. Phase transformations of hexagonal to monoclinic Cu6Sn5 driven by ageing, was suppressed by alloying Ni/Zn/Au, resulting in improvements in phase stability. The findings help to further understand the reliability of interfacial structures in micro-alloyed Pb-free solder joints.

Original languageEnglish
Pages (from-to)471-482
Number of pages12
JournalJournal of Alloys and Compounds
Volume685
DOIs
Publication statusPublished - Nov 15 2016

All Science Journal Classification (ASJC) codes

  • Mechanics of Materials
  • Mechanical Engineering
  • Metals and Alloys
  • Materials Chemistry

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