The influence of ageing on the stabilisation of interfacial (Cu,Ni)6(Sn,Zn)5 and (Cu,Au,Ni)6Sn5 intermetallics in Pb-free Ball Grid Array (BGA) solder joints

Guang Zeng, Stuart D. McDonald, Dekui Mu, Yasuko Terada, Hideyuki Yasuda, Qinfen Gu, M. A.A.Mohd Salleh, Kazuhiro Nogita

Research output: Contribution to journal › Article › peer-review

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